Product Announcements:
Solder

ALPHA^® Exactalloy^® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment.

The preform is placed directly into the solder paste prior to assembly reflow. Alpha Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving y... Read more...

Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Read more...

ALPHA OM-220 is a new, ultra-low temperature solder paste paired with ALPHA ULT1 alloy for soldering of temperature-sensitive components and substrates. This innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. Read more...

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA^® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC). Read more...

MacDermid Alpha Electronics Solutions announces the release of ALPHA HRL3 Solder Sphere, a lead-free, high reliability, low temperature alloy for ball mount applications. Read more...

MacDermid Alpha has high reliability material solutions for electronic assemblies used in a broad range of 5G related equipment; from wearable and handheld mobile devices to antennas and high speed infrastructure hardware. Download new brochure. Read more...

ALPHA OM-372 is designed for superior performance on assemblies with ultra-fine pitch components requiring excellent stencil transfer efficiency and high electrical reliability, such as those found in mobile and wearables, computing, and medical assemblies. Read more...

ALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 °C for minimized warpage induced defects and enhanced product reliability compared to existing low temperature solutions. Read more...

ALPHA OM-362 is the next-generation ultra-low voiding solder paste. This lead-free, zero-halogen, no-clean paste can deliver less than 10% voiding on Bottom Termination Components (BTCs). Low-voiding solder pastes are an important material in improving board level reliability by reducing this effect. Read more...