Electronic Components News
From GlobalSpec - a leader in industrial and engineering product news and information.About this eNewsletter
Frequency:
26 issues/year
Description:
Engineering360's Electronic Components Newsletter offers subscribers a variety of information on electronic design products and processes for application in computers, communications equipment, consumer electronics, and industrial systems. Topics included in this publication include circuit boards, active and passive devices, signal conditioning components, and interconnect devices to solve practical problems.
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Market Served: Automotive; Aerospace & Defense; Communications; Consumer Products and Electronics; Computers
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Archives
Past Issues of this eNewsletter
Volume 19 -
Issue 9 -
05/01/2024
eBook download: Basic Electronics Principles; Thermal management of QLS1046 space-processing module; Flexible circuits are a critical component of your product!
Volume 19 -
Issue 8 -
04/17/2024
IP67 key-fob plastic enclosure; Nano 360® Circular Connectors; Accuride's 301 series is an overachiever with a low profile; MCX N94x MCUs: Bringing more intelligence to the edge; Permanent magnets; C16 ultra miniature crystal offers tight stability
Volume 19 -
Issue 7 -
04/03/2024
MCX A series FRDM development boards; Signal conditioning for sensor applications; Thermally conductive, electrically non-conductive, low outgassing epoxy; What are temperature controlled oscillators (TCXOs)?
Volume 19 -
Issue 6 -
03/20/2024
IP68 high performance waterproof enclosure; Performance of counter-rotating fans with significant energy and noise reductions; 85/85 THB-rated MXT suppression capacitors for harsh environment; One part, die attach epoxy features high Tg; B2B component distribution — 1,000+ brand name suppliers; SpecTrax Lite is now svailable on our platform; Direct microwave conversion capabilities now made possible deep into the Ka-band
Volume 19 -
Issue 5 -
03/06/2024
Fully concealed fastening solutions: PEM® GHOST™ Fasteners; Less scrap, less handling and less risk of damage; Low-energy, long range: Download this tech paper to integrate Panasonic Industry PAN1781 seamlessly; Miniature C1E crystal now with extended frequency up to 96 MHz; Programmable quartz crystal oscillators with wide frequency and super-fast delivery
Volume 19 -
Issue 4 -
02/21/2024
Save space with THA thinpack capacitors; IoT devices and Wi-Fi 6E — Explore the benefits and key antenna selection considerations of Wi-Fi 6E for IoT; Process panel control made simple; Zero torque power distribution blocks; MSM II: The next generation pushbutton switch
Volume 19 -
Issue 3 -
02/07/2024
How AI is transforming electronics manufacturing; New high current interconnect (HCI) connector system
Volume 19 -
Issue 2 -
01/17/2024
Custom vs standard: Which option is right for your transformer?; Amphenol FCI MezzoStak® flexible printed circuit assembly; Economical outdoor network box; High temperature lead wire/nickel plated copper; KOA speer wide terminal resistors provide higher power ratings; Direct microwave conversion now made possible deep into the Ka-band
Volume 19 -
Issue 1 -
01/03/2024
Explore push-in terminal block PCB connectors; Optimizing connector solutions for DC fast charging and component interconnects in electric vehicles
Volume 18 -
Issue 26 -
12/20/2023
Custom wire harness solutions; Bringing AI to electronics assembly inspection; XW4M/XW4N dual spring connector
Volume 18 -
Issue 25 -
12/06/2023
Customized test and measurement accessories made in the USA; The secrets of a closed loop, sensorless, sine wave BLDC motor controller unveiled; Webinar: Adopting eFuses for zonal control units; Feedback loop compensation of a current-mode flyback converter with optocoupler; How to choose the right antenna; Radiation tolerant space compute intensive module
Volume 18 -
Issue 24 -
11/15/2023
Tech etch EMI and RFI shielding solutions; Your trusted source for quality electronic components; AxiForce — protect future technologies effectively; SourceToday top electronics component distributor; PJ-201 series by Components Corp; Film capacitors
Volume 18 -
Issue 23 -
11/01/2023
u-blox SARA-R510AWS LTE-M AWS IoT ExpressLink module; Rapid, low-temperature UV-curing improves production rates and quality; Silver-filled epoxy for die-attach applications; MLPS flatpack, low-profile, aluminum electrolytic capacitor, 10,000 hours at 105 °C; Electrocube capacitor series offers rugged alternative to electrolytic capacitors
Volume 18 -
Issue 22 -
10/18/2023
Reduce PC board assembly time with Peel-A-Way® carriers; IoT small plastic case; SMT and THM maxi "auto" blade fuse holders; Latest IGBTs and SiC for bidirectional inverters with coupled battery storage
Volume 18 -
Issue 21 -
10/04/2023
BMS signal isolation transformer; The key to sector coupling: Energy storage from phoenix contact; Ultimate cooling by air — EVAC module; Choosing inductors for energy efficient power applications; Rare earth magnets
Volume 18 -
Issue 20 -
09/20/2023
Custom vs standard: Which option is right for your transformer?; Reduce PC board assembly time with Peel-A-Way® carriers; Molex wire to board solutions: Mini-fit series; Long life 85/85 THB X1/X2/Y2 film capacitors for harsh environments; Lacing cords and tapes; Overcome the limitations of quartz OCXOs with SiTime's Epoch OCXO; Major distributor of China semiconductors; Solution for display testing in AR and VR headsets
Volume 18 -
Issue 19 -
09/06/2023
OPTA, the PLR which takes ease of programming, integration and innovation to a whole new level; Ultra-low-profile electrolytic is the world's thinnest at just 2.2 mm; Crystal and oscillator PCB design considerations
Volume 18 -
Issue 18 -
08/23/2023
How to build a custom resistive load bank; Connections that last — sealed connector solutions; Connector series benefits from 360° EMC backshells
Volume 18 -
Issue 17 -
08/16/2023
AURIX™ TC375 Lite Kit; Series A and B subminiature toggles; Introducing conduit clamps
Volume 18 -
Issue 16 -
08/02/2023
Intel® E810-XXVDA2 Ethernet network adapter; Automotive connector strategies and solutions for space reduction; Magnetic wire management
Volume 18 -
Issue 15 -
07/19/2023
How to protect electronics, enclosures and sensors from tampering, misuse; Introducing HellermannTyton conduit clamps; Heat can quickly take down your best electrical component designs.; Package transition in power diodes
Volume 18 -
Issue 14 -
07/05/2023
From SiC to thin SiC: Pushing power diodes to the next level; Addition-cured silicone resists thermal cycling and shock; High performance 3M™ crimp terminals
Volume 18 -
Issue 13 -
06/28/2023
Precision timing made easy with u-blox; Enabling miniaturization with micro 3D printing; 50% off overstocked electrical test accessories, made in USA
Volume 18 -
Issue 12 -
06/21/2023
IP68/IP67 network plastic box; Reduce PC board assembly time with Peel-A-Way® carriers; Digitize and automate inspection; Easy access to Asian supply chain sources; Long life, 85/85 THB-rated support industrial capacitors for harsh environments; Electronic chip or microprocessor MCU chip supply
Volume 18 -
Issue 11 -
06/07/2023
UV curing and IR heat improve electronic component production quality; Q-secure locking power cords; Connect with confidence; Standard supercapacitor modules for 9V, 18V and 30V outputs; Amphenol 2M series solution for tactical robots
Volume 18 -
Issue 10 -
05/17/2023
OPT3005DTS evaluation module; How to protect mission-critical equipment from tampering; damaging contaminants; Pixel-to-pixel inspection (and correction) ensures visibly perfect displays; AxiForce — Protect future technologies effectively; Ultra-low phase jitter differential output crystal oscillators for 10 Gbit Ethernet; Permanent magnets
Volume 18 -
Issue 9 -
05/03/2023
The best high-performance fasteners for aerospace and defense electronics; New 10000 series DC power supplies and Loads: No lead times!; Precision multicoax connector lines; Video: Epoxy system for dam and fill applications; New slide-in and SMT battery contacts
Volume 18 -
Issue 8 -
04/19/2023
Revitalize your systems — spares and repairs; Next-generation aluminum universal enclosure!; Powerful EMC filter simulation with SPICE; Single-chip, nine-axis sensor with embedded sensor fusion; B2B component distribution — 1,000+ brand-name suppliers
Volume 18 -
Issue 7 -
04/05/2023
eBook download: Design Considerations for Current Sense Transformers; Accuride EZ-Release kit; Adhesives and sealants your electronics need!
Volume 18 -
Issue 6 -
03/15/2023
IoT small plastic case for your IoT applications!; Reduce PC board assembly time with Peel-A-Way® carriers; Long life, 85/85 THB-rated AC filter capacitors for harsh environments; Is your specialty interconnect assembly the most important component?; Weather outside is frightful, but TE's sealed connectors are reliable
Volume 18 -
Issue 5 -
03/01/2023
Versatility and utility in a handheld enclosure; Molex quad-row board-to-board connectors; RadioCarbon high-power SDR with DPD development platform from Richardson RFPD; Support a wide variety of designs with TE spring fingers
Volume 18 -
Issue 4 -
02/15/2023
NXP semiconductors OM-SE050ARD-E development kit; Flexible test lead for diagnostics; manufactured in the USA; Directly buy electronic components online from Asia.
Volume 18 -
Issue 3 -
02/01/2023
Improve durability and production rates with UV and IR processes; Make human electronics inspection consistent and reliable; Standard TPE power retractile cords for most applications; Ultra-low-profile electrolytic is the world's thinnest at just 2.2 mm
Volume 18 -
Issue 2 -
01/18/2023
eBook download: Guide to Inductors; Integrated test solutions for 5G, data centers and high-speed test applications; Keeping your most vital systems up and running; Rare Earth magnets
Volume 18 -
Issue 1 -
01/04/2023
How to select space processing devices for in-orbit edge computing applications; Simulation driven design for electronics
Volume 17 -
Issue 24 -
12/21/2022
Solving for multiple design challenges with a single connection; Finding success using off-the-shelf hardware in custom electronics
Volume 17 -
Issue 23 -
12/07/2022
Get price & availability forecasts for critical components; Understanding the basics of analog design; AxiForce — Protect future technologies effectively.; Watch our data converters demonstrations introduced at Electronica 2022!
Volume 17 -
Issue 22 -
11/16/2022
nRF21540 DB Development Bundle (DB); New slide-in/SMT battery contacts; Take a deep space tour
Volume 17 -
Issue 21 -
11/02/2022
Insulation piercing harness-board connector on a threaded post; See the guts of the iPhone 14; Using a staking compound on a circuit board; CDE...your source for AC resonant and harmonic filter capacitors; Quartz-based MultiVolt oscillators
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