Semiconductor Manufacturing Handbook

As engineers, technologists, managers, professors, or students, we are all facing increasing challenges in a cross-functional manufacturing environment. For each project, we must consider: What are the givens? What are the unknowns? Which solutions are feasible, and how to validate these? How does one apply technical knowledge to assemble a solution plan, to support a team, or to lead and implement a project successfully?

Our challenges may include establishing wafer manufacturing processes, improving manufacturing yield, implementing automated manufacturing processes, establishing quality and safety programs, and expanding ancillary facilities. A good understanding of microchip fundamentals, wafer processing, manufacturing, gases and chemicals, operations, yield management, and facilities will enable one to plan, design, and implement projects efficiently and effectively.

The goal of this Semiconductor Manufacturing Handbook is to provide readers with the essential knowledge needed for working in a semiconductor wafer fab: for problem solving, for establishing manufacturing processes, for improving existing manufacturing lines in microchip fabs. This handbook embraces both conventional and emerging wafer processing, final manufacturing, yield management, and ancillary facilities used in the semiconductor industry. It also covers fundamentals of nanotechnology, microelectromechanical systems (MEMS), and flat panel display (FPD) that share similar wafer processing technologies and facilities.

The book is organized into six major sections that comprise 43 chapters. In general, each chapter includes three components—principles, operational considerations, and references. The principles cover the fundamentals of a technology and its application. Operational considerations include operations, safety, environmental issues, maintenance, and economics. There are useful tips for planning, implementing, and controlling manufacturing processes. The References and Further Reading sections are lists of relevant books, technical papers, and websites for additional reading. To standardize terminology, this handbook follows the Dictionary of Semiconductor Terms prepared by the SEMATECH.

Part 1 of the handbook gives background information on semiconductor fundamentals. How microchips are made, what materials are used, and common processes such as plasma and vacuum are introduced. Part 2 covers conventional and emerging wafer processing and technologies. Part 3 offers final manufacturing on inspection, grinding and dicing, and packaging. Part 4 discusses nanotechnology, MEMS, and FPD fundamentals. Part 5 covers specialty gases, chemicals, and slurry delivery systems. Part 6 reviews manufacturing operations including yield management, automated materials handling system, six sigma, EHS, fab and cleanroom design and construction, microcontamination control, airborne molecular contamination, electrostatic control, and wastewater treatment process.

The handbook covers topics ranging from wafer processing, final manufacturing, yield management, wafer fab and cleanroom design and construction, contamination control, and facilities management. Process engineers, industrial engineers, manufacturing engineers, facility engineers, quality engineers, R&D scientists, managers, teachers, students, and others will find this handbook to be a useful and enlightening resource because it covers the breadth and depth of microchip processing and manufacturing. Semiconductor Manufacturing Handbook is the most comprehensive single-source guide ever published in its field.