The Pro family of plasma etch and deposition tools is compatible with advanced silicon etch technology, which achieves the anisotropic deep-etched structures in silicon needed to make MEMS devices such as accelerometers; gyroscopes; precision spectrophotometer slits; and microactuator, micromotor, and microturbine components. The family consists of the Multiplex single-wafer or batch plasma etch or deposition system for R&D applications, which has a vacuum loadlock and one etch or deposition source; the MACS for pilot production, a cassette-to-cassette upgrade to the Mulitplex for loadlocked systems; and the ASPECT for fully automated volume manufacturing, a dedicated, cassette-to-cassette cluster platform. The systems have deep silicon etch rates of up to 20 µm/min, uniformities of ±3%, and deposition rates of boro phosphosilicate cladding layers for planar optical waveguides increased by 3.5X to 0.8 µm/min. The Stretch-To-Length gas-line heater system allows engineers to customize the thermal profile for any gas-line application. Superior to heat tape, the system reduces the potential for hot and cold spots on gas lines. With its preformed construction, it can be wrapped around the delivery line with consistent heater/gas-line contact, for improved temperature uniformity. Because it is flexible, it can compensate for components of varying sizes. The easy-to-install, two-part system fits on most gas-line configurations. It includes a 2-W/sq in. heater and silicone rubber foam insulation. With a maximum operating temperature of 200°C, the heater system can be used for gas lines that deliver boron trichloride, chlorine trifluoride, dichlorosilane, tetraethylortho-silicate, and tungsten hexafluoride. It can also be used for process-gas-line qualification. The DFP 200 dense-fluid processor is a fully integrated, 200-mm single-wafer chamber that enables the development and evaluation of technologies for deposition, cleaning, conditioning, and lithography applications using supercritical CO . The vacuum-compatible system can be integrated with vacuum-based processes on a single cluster tool. Supercritical CO processing offers an enabling
Products & Services
Semiconductor Cluster Tools
Semiconductor cluster tools and equipment are used to process semiconductor wafers for the production of microelectronic components.
Thin Film Equipment
Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation.
Electronic and Semiconductor Gases
Electronic and semiconductor gases are specialized for microelectronic manufacturing or semiconductor processing applications such as thin film deposition (CVD, PVD), etching, RTP, packaging or soldering.
Etchers and Etching Machines
Etchers and etching machines remove material from the surface of a part using an acid or alkaline chemical solution. Etchers and etching machines, also known as chemical milling machines, use masking substances to protect some surface areas of the part, providing selective material removal or patterning.
Wafer cassettes are used to transport and store wafers during semiconductor manifacturing operations. They are designed to house or carry several wafers of the same size and are available in a range of materials to support specific applications, such as thermal processing.
Topics of Interest
Designed for deep-oxide etching in MEMS and MOEMS applications, the AMS 200 DE (dielectric etcher) meets the requirements of using SiO quartz and other glasslike materials, which are often better...
and Nigel Stewart, Ian Sharp, and Dana Scranton, ) films on semiconductor wafers is and will continue to be an essential part of microelectronics manufacturing for the foreseeable future. The...
A simulation tool set enables photolithography engineers and IC designers to predict the manufacturability of their products before production. The LithoCruiser helps design and optimize lithography...
A noncontact, single-wafer, double-sided cleaner satisfies the demands of next-generation technology nodes. The 8200 spin processor has a throughput of 200 wafers per hour, providing an alternative to...
and Joseph Van Gompel and Peter Mawle, An exhaust management system developed to meet the industry's GWP emissions targets provides cost and time savings and can lower 300-mm tool footprint...