Designed to repair photolithography mask defects at the 65-nm node, the Accura XT+ DualBeam mask-repair system combines a focused ion beam (FIB) column and an environmental scanning electron microscope (ESEM) in a single system. The tool can accommodate current photomasks and be extended to next-generation technologies, including low-energy E-beam proximity projection lithography/stencil, extreme ultraviolet reflective, nanoimprint, chromeless phase lithography, and absorber stack masks. The system contains the VisIONary FIB column, which provides a small spot size and accurate beam placement for both imaging and repair. Patented environmental SEM technology enables E-beam repair and high-resolution E-beam imaging. The system also features an optical microscope for mask navigation and global alignment. The Cal=Trak SL-500 primary standard gas-flow calibrator is a fast, mercury-free, and easy-to-use instrument that offers standardized accuracy of ±0.4% in a portable, low-maintenance unit. The instrument's dimensionally based primary accuracy is superior to pressure-based secondary methods. The field-rugged system is used in the manufacture, inspection, validation, and recalibration of mass-flow controllers, flowmeters, and many other varieties of flow equipment in the 5-std cm /min to 50 std L/min range. Its broad turndown ratio allows three interchangeable flow cells to cover this range, minimizing initial investment and maintenance costs. The unit's modular nature enables users to begin with one flow cell and add others as resources allow. The calibration device provides primary NIST traceability, is manufactured under strict ISO 17025 certification, and is CE approved. The single-wafer VIISta 810XE ion implanter
Products & Services
Lithography equipment transfers circuit or device patterns onto a substrate using a patterned mask and a beam of light or electrons to selectively expose a photoresist layer. Overlay metrology systems align the pattern masks or reticules.
Ion Milling Systems
Ion milling systems use an ion beam to thin samples for transmission electron microscopy. Focused ion beam (FIB) systems use a narrow high current beam to mill specific regions or a low current beams to image samples (FIM).
Nanomaterials have features or particle sizes in the range of 1 to 100 nm.
Scanning Probe Microscopes
Scanning Probe Microscopes forms images of surfaces by using a physical probe that scans the specimen. Examples include AFM (atomic force microscopes), MFM (magetic force microscopes), STM (scanning tunneling microscopes) and many others.
Ion Beam Guns and Electron Beam Guns
Ion beam guns and electron beam guns produce beams of electrons, ions or other particles for use in chemical and surface analysis, particle physics, resin curing or semiconductor manufacturing.
State-of-the Art R&D Solution for Small Substrates and Pieces
Easy to use and compact in size the SUSS MicroTec MJB4 mask aligner represents the perfect system for laboratories and small volume...
Topics of Interest
Troy Morrison and Chris Marotta, As chipmakers continue toextend photolithographic processes to create subwavelength-sized features, photomasks have evolved from simple, binary, 2-D patterns of chrome...
Chapter 1: Nanolithography
Figure 1.1: Schematic of positive and negative resists.
Figure 1.2: (a) Characteristic curve of a hypothetical positive tone resist (b) optical projection...
An automated atomic force microscopy (AFM) tool designed for photomask applications, the Dimension X3D provides comprehensive profile and critical dimension (CD) metrics for a variety of materials,...
A simulation tool set enables photolithography engineers and IC designers to predict the manufacturability of their products before production. The LithoCruiser helps design and optimize lithography...
As silicon LSI devices continue to be scaled down in sire, the patterning process of resists on Si wafers is becoming more critical. For Si LSI, a reliable lithographic technology is needed to define...