MICRO: 'Round the Circuit On GlobalSpec

Lab: films to meet map goals Thin barrier films will satisfy the tight requirements defined in the semiconductor industry's technological roadmap, Infineon Technologies reports. The German chipmaker says its researchers recently shrunk film thicknesses to nanotechnology dimensions in order to demonstrate the ability of thin films to meet the metallization needs of next-generation devices. Specifically, the results indicate that the films will meet the electrical and functional targets all the way to the end of the International Technology Roadmap for Semiconductors In testing the scaling limits of Ta/TaN barrier technology, a team at Infineon's Munich Research Labs assessed the integration of metallic films required to keep copper metal lines from

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