From KLASTECH GmbH
There are a number of techniques that are utilised today in the post process on line optical inspection of semiconductor wafers. These include:
* Spectroscopic reflectometry where multiple laser wavelengths are shone down onto the surface of the thick film covered substrate to obtain information regarding the film thickness, density and purity
* Ellipsiometry, a similar technique but in this case information is gleaned by looking at the change in polarisation of the reflected light
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