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This document contains steady state thermal models for optocouplers based on empirical data and theoretical extrapolation. Seven thermal models have been chosen to suit the type of optocoupler: • Thermal Model-A for a hermetic-package optocoupler • Thermal Model-B for a single-channel plastic package optocoupler • Thermal Model-C for a single-channel HCPL-3700/60 optocoupler with input buffer circuit • Thermal Model-D for a dual-channel plastic package optocoupler • Thermal Model-E for a Single-Channel Optocoupler with input buffer circuit • Thermal Model-F for a single channel SO-5 plastic-package optocoupler • Thermal Model-G for a dual channel SO-16 plastic-package optocoupler • Thermal Model-H for a Quad channel SO-16 plastic-package optocoupler • Thermal Model-I for a dual-channel bidirectional SO-8 plastic-package optocoupler The thermal data in each of these models allows the user to calculate the approximate junction temperatures at various nodes in the optocoupler. The actual semiconductor junction temperatures may vary based upon the heat flows from the surrounding components on the printed circuit board. Each of the models assumes that the optocoupler is either soldered to a printed circuit board (PCB) or placed in a socket, which is soldered on a PCB. The PCB is further assumed to be in still air. In models that define the optocoupler case to be a node, the case-to-ambient thermal resistance will depend on the board design and the placement of the optocoupler. The package case temperature is measured at the center of the package bottom.

Thermal Data for Avago Optocouplers - App Note (.pdf) - Optoelectronics