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From avagotech.com
The HSMR-CL25 series of parts is designed with an ultra small form factor to allow this miniaturization. The HSMR-CL25 series is the thinnest available top emitting package in the market with high brightness InGaN die technology. The leadframe construction of this package allows the part to transfer heat from the package, thus it is able to survive temperature conditions of -40°C to 85°C despite its small size. The target applications are Keypad backlighting, Push button backlighting and Status indicators.
The target markets are Mobile Handsets, Communications, Office Automation, Industrial and Commercial automations, Home Market appliances, Networking, Medical Instruments, and Mobile Computing. This product is competitively priced, and production is geared towards short lead times and ample capacity.
Products & Services
Integrated circuit packaging is the final stage of semiconductor device fabrication in which the bare die or bare boards are placed inside of a protective packaging that provides connectors or pins for connecting to other devices.
Mobile and wireless software is used to program and manage mobile and wireless devices such as cell phones, personal digital assistants (PDA), and global positioning systems (GPS).
Vacuum fluorescent displays (VFD) provide high brightness, wide viewing angles, and relatively low cost.
LED drivers control the amount of current and voltage supplied to light emitting diodes (LEDs), when in operation.
Suppliers of membrane switches and keypad assemblies using flexible membranes, domed or flat switch profiles, and tactile and non-tactile switches and panels.
Product Announcements
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