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0.25mm Blue Leadframe-Based Surface Mount ChipLED

From Avago Technologies
 

 
The HSMR-CL25 series of parts is designed with an ultra small form factor to allow this miniaturization. The HSMR-CL25 series is the thinnest available top emitting package in the market with high brightness InGaN die technology. The leadframe construction of this package allows the part to transfer heat from the package, thus it is able to survive temperature conditions of -40°C to 85°C despite its small size. The target applications are Keypad backlighting, Push button backlighting and Status indicators. The target markets are Mobile Handsets, Communications, Office Automation, Industrial and Commercial automations, Home Market appliances, Networking, Medical Instruments, and Mobile Computing. This product is competitively priced, and production is geared towards short lead times and ample capacity.

Products & Services
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