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Key Considerations for Implementing SBL Applications

From Interplex Industries, Inc.

With conventional soldering processes, the two metal components to be joined are first brought into position and mechanically held in place. Then flux and solder are applied to the conjoined parts, typically by a dipping process. When the circuit is dipped into a flux pot, care must be taken to not over flux, or cover too much area. The circuit is next dipped into a molten solder pot and care must be taken to avoid solder bridges or solder wicking into unwanted areas. The biggest issue is the inability of the solder dipping process to consistently assure precise and complete coverage of the desired areas on the pad and pin, which can result in variances of solder joint quality and reliability.

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