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LIGA
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LIGA

LIGA, a German acronym for x-ray lithography (lithographie), electroplating (galvanoformung), and molding (abformung), is used to fabricate high aspect-ratio structures in micro-electromechanical systems (MEMS). LIGA combines photolithography, electroplating and molding process to obtain depth. Patterns are created in a substrate and then electroplated to create three-dimensional (3D) molds. These molds can be used as final products, or various materials can be cast or injected into them. LIGA is a type of high aspect ratio micromachining (HARM) that can be used with materials other than silicon (e.g., metal, plastic). There are three main types of LIGA processes: x-ray LIGA, UV LIGA, and silicon LIGA. The original LIGA technology, x-ray LIGA uses x-rays from a synchrotron. UV LIGA uses ultraviolet (UV) light, typically from a mercury lamp. Silicon LIGA uses deep reactive, ion-etched silicon.

 


Products & Services
MEMS foundry services suppliers design and manufacture microelectromechanical devices on a contract basis, in prototype to production quantities.
MEMS processing equipment is used to create micro-electro-mechanical systems (MEMS) sensors and wafers.
X-ray diffraction instruments are used to measure crystal structure, grain size, texture and/or residual stress of materials and compounds through interaction of the X-ray beam with a sample.
Lithography equipment transfers circuit or device patterns onto a substrate using a patterned mask and a beam of light or electrons to selectively expose a photoresist layer. Overlay metrology systems align the pattern masks or reticules.
X-ray instruments and X-ray systems use penetrating X-rays or gamma radiation to capture images of the internal structure of a part or finished product.
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Product Announcements
DRC / Metrigraphics Division - Embossing Mold
Embossed micro structures are used in a variety of applications, some are; • Micro-embossing Molds (microfluidic and LCD flat panel arrays) • Monofilament Supports (mechanical retainers... (read more)
Advanced MicroSensors, Inc. - MEMS Foundry Services: Process Capabilities
The variety of processes, materials and equipment available at AMS gives our customers more freedom in designing their MEMS or sensor products. (read more)
Hamamatsu Corporation USA - CCD Image Sensors
Hamamatsu designs and manufactures various types of image sensors that cover a wide range of intensity levels and spectral response ranges. Devices operate from near infrared (NIR) at 2.6 µm, through... (read more)
DRC / Metrigraphics Division - Custom Micro Structures
Three-Dimensional Electroformed Micro-Structure Capability The Metrigraphics Division of Dynamics Research Corporation has developed a unique process for the manufacture of high aspect ratio... (read more)
ELCAN Optical Technologies - Reduced cost with increased performance - ELCAN!
IDC Dreamt... ELCAN Created IT! ELCAN redesigned the entire assembly and subsequently reduced the manufacturing costs while simultaneously advancing the performance of the unit... (read more)
ELCAN Optical Technologies - Reduced Cost and Increase Performance - ELCAN!
IDC Dreamt... ELCAN Created IT! ELCAN redesigned the entire assembly and subsequently reduced the manufacturing costs while simultaneously advancing the performance of the unit... (read more)
Memstech - Silicon Microphone by MemsTech with Pre-Amp ASIC
MemsTech has created "MSM1C - MSM2C" , the next generation of audio sensor technology. The MSM silicon microphone series will push the microphone industry into the age of silicon technology, bringing... (read more)
Hamamatsu Corporation USA - S10141-1008S CCD Image Sensor
The S10141-1008S CCD Image Sensor is a back-thinned type FFT-CCD with pixel size of 12 um. It also features a low readout noise and high resolution back-thinned CCD image sensor with built-in... (read more)
Infotonics Technology Center Inc. - MEMS Fabrication
In Microsystems, one size does not fit all. That's why ITC develops complete solutions on a project-by-project basis. To ensure they meet your exact requirements, Infotonics Technology Center Inc. (read more)
 
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Topics of Interest
Solid-state or semiconductor X-ray diffraction detectors collect diffracted intensity from one angle at a time and are scanned through the angular range of interest. These detectors provide the energy... (Read More)
AP3 ultra-thin polymer windows are the highest performing x-ray windows available for low energy x-ray analysis. AP3 windows are ideal for applications that require high x-ray transmission of light... (Read More)
The resolution of Fresnel zone plate (FZP) as X-ray lens is determined by the width of outer-most zone, and the diameter of condenser lens is desirable to be large so that bright x-ray beam is... (Read More)
A breadboard setup constructed at MOXTEK, Inc., is capable of capturing both x-ray diffraction (XRD) and x-ray fluorescence (XRF) information simultaneously using a charge-coupled device (CCD) as the... (Read More)
As silicon LSI devices continue to be scaled down in sire, the patterning process of resists on Si wafers is becoming more critical. For Si LSI, a reliable lithographic technology is needed to define... (Read More)
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See more product announcements for MEMS Foundry
MEMS Fabrication

MEMS Fabrication
Infotonics Technology Center Inc.


MEMS Device Fabrication

MEMS Device Fabrication
Merit Sensor Systems


MEMS Foundry Services: Process Capabilities

MEMS Foundry Services: Process Capabilities
Advanced MicroSensors, Inc.


11 See more product announcements for MEMS Foundry



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