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The Engineering Toolbar
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From SynQor, Inc.
SynQor base-plated units are designed for Wave Solder or Selective Solder Processing as a means for attachment to the customer parent board assembly. Reflow solder processes (Convection, IR, Vapor Phase) can expose the base-plated convertor to temperatures which exceed the melting point of the solder used to assemble the unit which can cause internal damage beneath the base-plate. SynQor does not approve the use of Reflow solder processes for base-plated units. Product Announcements
Topics of Interest
This document contains two charts: Recommended Solder Profile – Reflow (SMD Type) and Recommended Solder Profile – Wave Solder (Through Hole Type). The Recommended Solider Profile – Reflow (SMD Type)...
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To achieve the best performance from M/A-COM's LSM1 VCO series, it is critical that good design practices are used in the layout of the printed circuit board. This application note describes the pad...
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The CA and NA series of MOV varistor discs with silver electrodes are specifically designed for custom assembly and packaging. To take advantage of the excellent performance and reliability of...
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Pulsed-Heated Hot-Bar Reflow Soldering is a selective soldering process where two pre-fluxed, solder coated parts are heated to a temperature sufficient to cause the solder to melt, flow, and...
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Retention of the press-fit pin prior to wave or reflow soldering is provided by the thickness of the copper plating in the holes.The across points dimension of the geometric feature is made the same...
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