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Managing Heat Transfer With Potting Compounds

From Epoxies Etc...
 

 
Today's electronic designs are smaller in size and deliver more power, which requires that they run at higher temperatures. In order to maintain long life and high reliability, they must be able to dissipate that heat efficiently. Fans, vents and other cooling devices take up valuable design space and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control heat build-up in an electronic assembly. Epoxies, urethanes and silicones are used to bond heat sinks, encapsulate power supplies and individual components and protect motors from overheating. Thermal conductivity (k) is the property of a material that indicates its ability to conduct heat. Air and other gases are poor conductors of heat (good insulators). Metals such as silver and copper are generally the best conductors of heat. Diamond has the highest thermal conductivity value.
Product Announcements
S-Bond Technologies LLC - Graphite, Carbon, Carbide and Diamond Joining
Simple joining of carbon based materials to themselves and other metals. No plating or flux required. (read more)
Epoxies Etc... - Thermally Conductive UL 94 V-O Potting Compound
Epoxies etc...'s 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. Offering a unique combination of properties seldom seen... (read more)
S-Bond Technologies LLC - Thermal Management Component Services by S-Bond
Bonding and assembly services for cold plates, heat spreaders, heat sinks of all materials and combinations, electronic die attach and direct bonding of electrical components. (read more)
Epoxies Etc... - Flexible & Vibration Resistant Potting Compounds
Design more durable, vibration resistant, moisture proof electronic assemblies at a savings of up to 80% with Epoxies, etc… revolutionary breakthrough potting compound. The new 20-2353 solves... (read more)
Value Engineered Products, Inc. - Aluminum / Copper Bonded Heat Sinks
A bonded fin heat sink removes the design limiting fin extrusion ratio found in extruded heat sinks. Typical extrusion fin ratios at VEP are generally from 4:1 up to 16:1. However, VEP currently... (read more)
Master Bond, Inc. - Two Part Epoxy Offers Improved Thermal Management
Master Bond's EP30BN two part boron nitride epoxy is a thermal adhesive used for bonding, sealing and potting, designed to optimize heat dissipation of aerospace, defense and microelectronic... (read more)
Topics of Interest
Many electronic components and assemblies require a potting compound for protection against moisture, thermal shock, vibration and very low temperatures. Most of the potting & encapsulating compounds... (Read More)
Thermally conductive materials are an effective way to resolve a variety of design and processing challenges. They fall into the categories of adhesives, coatings, films, encapsulants, and greases. (Read More)
Epoxy (EP) resins exhibit high strength and low shrinkage during curing. Epoxies are known for their toughness and resistance to chemical and environmental damage. Most epoxies are two-part resins... (Read More)
In applying high power attenuators and terminations to RF and Microwave circuits there are a number of requirements to be observed to obtain satisfactory life. These are heat-generating devices so the... (Read More)
Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use... (Read More)