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From MINTEQ® International Inc, Pyrogenics Group
Thermal management design engineer ideals: materials that optimize new, state of the art cooling and tight packaging needs meeting functionality and commonality requirements; flexible package solution that can be used for different applications; isotropic spreader material with thermal conductivity greater than copper and minimum material conductivity of 1000 W/mK; high in plane (x-y) for efficient spreader thermal conductivity; high through plane (z) thermal conductivity for heat flux "hot"spots; yielding maximum thermal performance for power intensive applications; low, tailorable coefficients of thermal expansion; low density, low weight to minimize shock loads; economical cost, near net shape, high volume capable manufacturing; and high structural strength and stiffness. Thermal challenges are driving a serious review of graphite spreader material, but not all graphites are the same. Issues: thermal conduction values that are affected by imperfections; limited thickness to 1.5 mm; and physical strength limitations. PYROID® HTPyrolytic Graphite approaches theoretical carbon density.
Products & Services
Product Announcements
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Minteq Pyrogenics Group powerful new weapon in the battle against thermal heat in state of the art electronic circuits and devices
PYROID® HT Pyrolytic Graphite thermal spreader and heat sink...
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MINTEQ Pyrogenics Group - Recent test results indicate laser diodes are able to increase their output by more than 50% with Pyroid® HT heat spreader.
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Have you always wanted to try Pyrolytic Graphite in your application but were concrened with cost?...
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Minteq Pyrogenics Group PYROID® Pyrolytic Graphite (PG) is a specialized, "five-nine" purity, chemical vapor deposition (CVD), carbon products grown atom-by-atom with unique thermal, electrical and...
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Thermal pads are superior in efficiency and last longer than thermal paste - a commonly used material for computer processors and other heat-sensitive components.
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Bonding and assembly services for cold plates, heat spreaders, heat sinks of all materials and combinations, electronic die attach and direct bonding of electrical components.
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The Pyrogenics Group is a world leader in the production of extreme-purity, freestanding PYROID® Pyrolytic Graphite (PG) films and stripper foils. PYROID® PG film is available at any thickness between...
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Carbon-Carbon composites are various forms of carbon fiber based preforms, that are reinforced by chemical vapor infiltration (CVI) or resin impregnation, using high temperature vacuum furnaces...
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Topics of Interest
Pyroid® HT pyrolytic graphite has a thermal conductivity of 1700 W/m ºK in the x-y plane of the material (7 W/m ºK in the z plane), costs less than 250 times that of diamond produced by chemical...
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Copper graphite is a composite mixture of graphite and copper metal (~15 to 95%), resulting in a material with higher conductivity than pure graphite and lower friction or sticking than pure copper in...
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Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use...
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The following table contains detailed data for a wide variety of thermal interface enhancement materials. Not all of these have been qualified for spacecraft use. Verification of suitability for use...
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Metal graphite is a composite mixture of graphite and a metal, usually copper, which provides higher conductivity than pure graphite and lower friction or sticking than pure metal in sliding contact...
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