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From veeco.com
The photomask industry is being challenged as never before; ”mask makers’ holidays” are a thing of the past. New materials with smaller structures demand innovative ways to address the metrology and processing of photomasks. No single technology will meet all the needs of the customer semiconductor industry. Reduced process windows due to MEEF (mask error enhancement factor), 1° control of hard shifters, charging of attenuating thin films and photoresist, area control of OPC features, confirmation of complex simulations in printed features, and unprecedented levels of contamination control all add up to a requirement for a flexible, fast metrology solution that won’t contaminate the masks during any phase of inspection. Products & Services
Lithography equipment transfers circuit or device patterns onto a substrate using a patterned mask and a beam of light or electrons to selectively expose a photoresist layer. Overlay metrology systems align the pattern masks or reticules.
Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.
RF waveguide phase shifters are two-port waveguide modules that alter the phase of an output signal in response to an external signal.
Coating masks, stencils, spacers and fixtures are tooling used in plating, thermospraying, painting or other coating processes. Masks block deposition from certain areas. Stencils or blocked off silk screens allow pattern coating and graphics printing.
Dimensional measurement and metrology services use mechanical gaging, CMM measurement, non-contact imaging or other specialized methods to inspect and measure part dimensions and geometry.
Product Announcements
Topics of Interest
3D Atomic Force Microscopy as an Alternative to X-SEM and TEM for Advanced Process Metrology double for each device node at 90nm Introduction and below, which means a significant As increasing demand...
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As increasing demand for smaller device feature data drives wafer development costs up, process developers seek new metrology solutions to better address today’s stringent process requirements.
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As 45nm is introduced into production and 32nm node is in extensive development there is an an increasing need for accurate CD metrology in both process development and in-line manufacturing control.
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This application note highlights the issues with Shallow Trench Isolation (STI) etch metrology, current metrology techniques and the benefits of Atomic Force Microscopy (AFM) for characterization and...
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Cross-section SEMs and FIB (focus ion beam) SEMs, long used for characterizing advanced photoresist processes, are no longer capable of providing sufficient information for today’s highly refined...
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Technical Articles
Using the Dimension X3D AFM in Advanced Photomask Metrology (.pdf)
- Machine Vision Equipment
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