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Laser Weld Attachment Enables Repeatable Submicron Precision

From Miyachi Unitek Corporation
 

 

The ability of laser welding to join optoelectronic components with repeatable submicron precision distinguishes it from other forms of attachment technologies, including laser soldering, ultraviolet-cured epoxy, and thermally cured epoxy. The need for submicron precision arises from the requirement to efficiently couple single-mode fibers waveguides, or modulators.

Process yield and repeatability have often dictated the use of laser welding in the manufacture of laser modules. Typical attachment tolerances can be 250 nm, with alignment requiring optical beam-profiling step sizes of 50 nm. This level of precision generally precludes of epoxy and soldering attachment due to difficulty in achieving repeatability at submicron tolerance in a manufacturing environment.

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Topics of Interest
Electronic circuits exposed to corrosive conditions, or required to have extreme performance characteristics, are sealed hermetically into special packages. Epoxy gluing, resistance welding,... (Read More)
Laser welding uses an intense energy beam as its heat source. It is accomplished at very high speeds with low heat generation and little or no distortion. Because filler materials are not required,... (Read More)
With precise energy control and application flexibility pulsed Nd:YAG lasers offer a unique non-contact welding source. The flashlamp pumped (FP) Nd:YAG laser distinguishes itself from other laser... (Read More)
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W. Jiang, Department of Electrical and Computer Engineering, Rutgers University, Piscataway, NJ 08854, . USA. e-mail: wjiangnj@ece.rutgers.edu Michelle L. Povinelli, Ming Hsieh Department... (Read More)