Heard on the Beat (July 13) Commentary & analysis of week's chip news Applied offers deep-trench silicon etch chamber for sub-100-nm DRAM processes SANTA CLARA, Calif.--Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching technology for 100-nm and below process geometries. TEL enters integrated metrology market with technology for 0.10-micron devices TOKYO -- Bearing the first fruit from its recent acquisition of Timbre Technologies Inc., Japan's Tokyo Electron Ltd. (TEL) here today entered the integrated metrology market by announcing a new technology for use in devices at the 100-nm node and below. TEL's so-called Optical Digital Profiling (ODP) technology enables the development of advanced, integrated metrology capabilities for its various tools. The Japanese chip-equipment giant plans to integrate this technology in its etchers, wafer track, and other systems by the middle of 2002. Hynix moves closer to wafer-level test of fast DRAMs SEOUL -- Korea's Hynix Semiconductor Inc. has demonstrated the ability to perform high-speed wafer-level testing of DRAM devices using a probe system from Teradyne Inc. and probe cards from FormFactor Inc., the companies announced today. DSP Group to license Siliver baseband processor next-generation GSM handsets SANTA CLARA, Calif. -- DSP Group Inc. here announced it will license a combination baseband processor/radio-frequency (RF) core for next-generation handsets based on the global system for mobile communications (GSM) standard. Co-Developed by DSP Group and a French design house called Stepmind, the Silver-1 core enables systems manufacturers to build a dual-mode handset based on the GSM/GPRS/EDGE standards. Rambus slashes royalty rate for SDRAM customer Rambus Inc. for the next year will allow a "major (synchronous DRAM) licensee" --- believed to be Samsung Electronics Co. --- to make single reduced quarterly payments instead of paying royalties, company officials revealed Thursday in the conference
Products & Services
DRAM and SDRAM Memory Chips
Dynamic random access memory (DRAM) chips are single-transistor memory cells that use small capacitors to store each bit of memory in an addressable format that consists of rows and columns. Because capacitors are unable to hold a charge indefinitely, DRAM memory chips require a near-constant pulse of current to retain stored information.
Photolithography Services
Photolithography services create photomasks and use them to etch or engrave patterns on semiconductor substrates.
Lithography Equipment
Lithography equipment transfers circuit or device patterns onto a substrate using a patterned mask and a beam of light or electrons to selectively expose a photoresist layer. Overlay metrology systems align the pattern masks or reticules.
GPRS Chips
GPRS chips use general packet radio service (GPRS), a standard for wireless communication with a throughput rate of 115 kilobits per second.
Bluetooth® Chips
Bluetooth® chips are board level components which broadcast in the 2.4 GHz industrial, scientific, and medical (ISM) radio band.
Product Announcements
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Trion Technology Oracle RIE Dielectric Etch Cluster Tool, 2006...
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Topics of Interest
Heard on the Beat (May 24) Heard on the Beat (May 24) DRAM prices tumble, but 3Q shortage looms Weak demand sent contract prices for 128Mbit SDRAM plummeting as much as 20% in May. Group gains on...
Hynix' suit against Rambus is delayed by U.S. court LOS ALTOS, Calif. -- The U.S. District Court for the Northern District of California late today temporarily delayed a ruling in Hynix Semiconductor...
UMC, Infineon may push out tooling of 300-mm fab in Singapore SINGAPORE -- The tooling of a joint-venture 300-mm wafer fab here between United Microelectronics Corp. and Infineon Technologies AG could...
Agilent announces new memory tester PALO ALTO, Calif.-- Agilent Technologies Inc. here has expanded its line of automatic test equipment, rolling out a system for use in testing high-speed...
Heard on the Beat (Nov. 30) Heard on the Beat, Nov. 30 TEL enhances prober to handle mix of 200- and 300-mm wafers TOKYO -- In a move to increase flexibility and throughput in wafer-test operations,...
