The number of new semiconductor fabs being built in the U.S. has reached an unprecedented high. Shortages of on-site skilled labor are pushing the industry to adopt off-site manufacturing (OSM) and modularization strategies. While there are many advantages of utilizing an OSM approach, it also introduces new challenges and requires strong collaboration between the design firm, module integrator, and pipe spool fabricator, as well as other principles.

This article is written as a brief guide to highlight several areas where problems can arise in the design and construction of modular piping systems.

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