Engineered for demanding optical bonding applications, Dymax 9803 delivers reliable performance and process flexibility in compact assemblies. Typical applications include lens bonding, bonding the lens barrel to holder, or bonding the holder to printed circuit boards (PCBs).

• Fast LED/UV light cure and low-temperature heat cure for shadow areas
• Exhibits less overall movement through thermal excursions
• Low shrinkage and minimal outgassing for sensitive components
• Maintains bead shape with high viscosity and thixotropy upon dispense
• Enhanced resistance to 85°C/85% RH environments