Resilient Encapsulant for PCB and Electronic Assembly

Engineered for rapid, reliable protection of complex electronic and microelectronic assemblies, this light-curable encapsulant enhances resistance to moisture, thermal cycling, and abrasion while maintaining flexibility and adhesion to substrates such as PCBs, ceramics, lead frames, flex circuits, and silicon. Its low modulus and low glass-transition temperature help absorb mechanical stress, reducing strain on delicate wire bonds and fine interconnects.

Dual-Cure Processing Flexibility

The material cures in seconds upon exposure to UV or visible light and includes a secondary heat-cure mechanism for shadowed areas. This dual-cure feature ensures complete polymerization even in dense assemblies or under components, improving overall reliability and throughput.

Process and Performance Advantages

The one-part formulation simplifies dispensing and eliminates mixing or pot-life concerns. Formulated without solvents or isocyanates, it delivers high ionic purity and consistent coverage across complex geometries.

Key benefits include:

• • UV/Visible light cure for fastest processing
  • Secondary heat cure for shadowed areas
  • Low modulus and low Tg for wire-bond protection
  • Clear cured appearance for optical inspection
  • RoHS2 compliant (Directive 2015/863/EU)

Applications

Ideal for chip-on-board, chip-on-flex, multi-chip modules, and wire-bond encapsulation. Compatible with Dymax UV/LED spot lamps, flood lamps, and conveyor systems that provide balanced UV and visible wavelengths for fast, deep cures.