In a recent webinar, experts from Micross — a leading global provider of mission-critical microelectronic components, services and specialized packaging for high-reliability markets — discussed the resources and requirements to develop an efficient and reliable advanced packaging supply chain for U.S.-based microelectronics production. 

Micross is equipped to provide OEMs and CMs with a comprehensive understanding of onshore resources currently available, and the guidelines needed to navigate the risks in developing a U.S.-based advanced packaging supply chain for high-reliability microelectronics. 

Download the white paper to learn more.