ICROS® TAPE is used to manufacture integrated circuits as a surface protective tape in the silicon wafer back-grinding process. Since ICROS TAPE uses special adhesives which hardly transfer to the wafer surface, it can reduce production costs and eliminate environmental problems by dispensing with organic washing solvents. The consistency in its wafer thickness after back grinding and minimal wafer breakage are only two of the attributes that contribute to its reputation and reliability.

Characteristics of ICROS Tape make it ideal for use in manufacturing integrated circuits as a surface protective tape in the silicon wafer back-grinding process.

· Low contamination

· Simple water rinsing

· Superb softness

· Minimizes wafer breakage

· Uniform thickness

· Precise wafer thickness after back-grinding

For more information, please visit: http://www.mitsuichemicals.com/icr.htm