Next, let's take a look at the product information of PCBWay's latest 22-layer 4-order Rogers high-frequency HDI PCB with pure lamination and ultra-high aspect ratio.

Stack-Up and Parameter Overview

• 22 Layer HDI PCB Stackup

• Parameter Overview

Number of Layers: 22

Board Thickness: 6.9mm

Minimum Hole Diameter: 0.45mm

Number of Laminations: 5

Via Process: vias filled with resin

Aspect Ratio: 15:1

Impedance: 50Ω ± 3Ω

Trace Width/Spacing: 4mil/4mil

BGA Diameter: 8mil (16 groups), each group corresponding to 12 RF trace

Application Fields and Frequency Bands

• Application Fields: 5G Base Station

• Frequency Bands: 26GHZ