Package Tester for Burst Tests, Creep Tests, Creep-to-Failure Tests, and Leak Integrity Tests

Featured Product from TM Electronics, Inc.

Package Tester for Burst Tests, Creep Tests, Creep-to-Failure Tests, and Leak Integrity Tests-Image

Package Testers: the TME Smart BT Integra-Pack

Package Tester for Burst Tests, Creep Tests, Creep-to-Failure Tests, and Leak Integrity Tests
The smart TME BT Integra-Pack© is a bench-top, high-resolution (0.001 psig) test instrument with a small footprint and user-friendly ease of operation. Electronic pressure and flow controls provide precise and repeatable test conditions, while automatic and high flow output allow testing of large porous packages. Applications cover a range of flexible or rigid, porous and non-porous, open or sealed packages.
The BT Integra-Pack is a definitive step forward for traditional burst testing. A completely integrated process control tool, the instrument is not only valuable at the point of testing, but is also able to transmit your data from direct process control to your quality department, making it a quality control tool as well. Its objective is to enable you to produce a package that is as valid as the product enclosed.