Copper Composite Materials combine the excellent thermal conductivity of copper with the low thermal expansion characteristics of Kovar, Invar, and steel. These engineered sandwich composites provide an effective balance between thermal management, dimensional stability, and cost efficiency.

Compared with molybdenum-copper and copper-molybdenum-copper materials, these composites offer lower material costs and higher manufacturing yields, making them an attractive solution for demanding thermal management applications.

Key Features:

• High thermal conductivity
• Controlled thermal expansion
• Excellent dimensional stability
• Good corrosion resistance
• Cost-effective alternative to CMC and CPC materials

Applications:
Electronics packaging, hermetic seals, aerospace components, power electronics, industrial equipment, and precision engineering systems.

Learn more about our advanced copper composite materials.