Product Announcements:
IC Sockets and Headers

Smiths Interconnect, a division of Smiths Group plc, announces that it has completed the acquisition of Plastronics Sockets & Connectors (“Plastronics”), a leading supplier of burn-in test sockets and patented spring probe contacts for the semiconductor test market segment, as well as custom connectors for industrial applications. Read more...

LGA 4677 Socket

TE Connectivity’s (TE) next-generation server processor LGA 4677 socket provides more connections between main board and CPU. Designed for the needs of new generation processors, these sockets support bandwidth intensive operations and contain a greater number of memory channels – greatly expanding input/output capabilities. Read more...

TE Connectivity 's (TE) PCIe Gen 5 CEM connectors can enable all generations of PCI Express signaling and address the needs of higher speed performance with a roadmap of data rates that can reach up to 32 gigtransfers per second (GT/s) per differential signal pair. We can provide a broad product portfolio, early sample support, quick mass production and high reliable signal integrity per... Read more...

High Performance Compression Mount Sockets

Amphenol's patented compression mount contact technology utilizes industry-leading alloys to make cost effective and electrically robust socket solutions that offer high performance. Read more...

Flip-Top™ Test Sockets are engineered for BGA and LGA device test, validation, development, and production socketing applications. Surface mount and through-hole designs from 0.50mm to 1.27mm pitch. Read more...

Peel-A-Way^® Removable Socket Terminal Carriers from Advanced Interconnections.

Peel-A-Way^® products are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. Read more...

Available in through-hole and surface-mount options, TE Connectivity's DDR4 DIMM Sockets are high-quality memory sockets for always-on applications, including data center servers, communications equipment, workstations and high-performance computing applications. Compared to DDR3 DIMM sockets, these sockets offer up to 20% PCB space savings, up to 10% height reduction, up to... Read more...

Peel-A-Way^® Removable Socket Terminal Carriers from Advanced Interconnections.

Peel-A-Way^® products are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. Read more...

Peel-A-Way^® DIP Socket Terminal Carriers from Advanced are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. Read more...

Flip-Top™ BGA Test Sockets from Advanced Interconnections Corp. simplfy testing and validation of BGA and LGA devices, saving space on the board and speeding the test process. Watch our new video to see how easy it is to use. Read more...