Hermetic Solutions Group

We combine titanium and Mo/Cu heat sinks for lightweight hermetic electronic packages with low-coefficient of thermal expansion (CTE), and high thermal conductivity - ideal for handling the heat created by gallium arsenide electronic circuitry. Read more...

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Hermetic Solutions Group

Our composite titanium hermetic electronic packages use CuMo heat sinks to beat the heat and protect mission critical electronics. Read more...

More Product Announcements from Hermetic Solutions Group