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Umicore Metal Deposition Solutions

AURUNA® 311 For Technical Applications Gold Cobalt Electrolyte For the adhesive direct gold-plating of stainless steel and nickel Read more...

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Umicore Metal Deposition Solutions

ARGUNA® 3430
The electolyte, which is also cyanide-free, is used for the deposition of abrasion resistant silver coatings with high hardness. They are therefore particularly suitable for use on highly stressed electrical contact surfaces such as charging connectors. Read more...

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Umicore Metal Deposition Solutions

ARGUNA® 3230 is a cyanide-free fine silver electrolyte for the deposition of technical-functional and decorative silver coatings, which can also be used in demanding areas such as medical technology or electronics. Read more...

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Umicore Metal Deposition Solutions

ARGUNA® 630 is, suitable for electromechanical components that are exposed to increased mechanical stress. The higher hardness and reduced wear of the coatings show particular advantages in the case of more severe vibration and temperature stresses on contact surfaces and connectors. Read more...

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Umicore Metal Deposition Solutions

Umicore Metal Deposition Solutions, a business unit of the Umicore Group, has developed a new, innovative electrolyte for electroplating with pure platinum: PLATUNA® PT. The electrolyte enables the deposition of exceptionally thick, homogeneous and crack-free platinum layers, which are particularly convincing in various technical applications. Read more...

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Umicore Metal Deposition Solutions

A recent article on Global Spec deals with Umicore's product portfolio for the semiconductor segment. In particular with their copper additives of the IntraCu® series, which bring advantages in terms of the performance of ICs, among other things. Read more...

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Umicore Metal Deposition Solutions

Learn how our silver-graphite dispersion electrolyte meet the requirements of manufacturers sustainably and thus also economically. Read more...

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