Discover light-cure adhesives, curing equipment, and dispensing systems for EV battery and electronics assembly. (read more)

The Science of Bonding white paper explains how adhesive chemistry, process controls, and substrate surface energy interact to determine bond reliability. It highlights why surface condition often drives adhesion failures and shows how water contact angle measurement can be used to assess bonding readiness. (read more)

Implementing a successful light-curing process requires selecting the right materials and equipment tailored to each unique bonding application. Reliable adhesives that meet industry standards help prevent failures and ensure efficient, consistent manufacturing outcomes. (read more)

A PCB manufacturer increased production output by 30% using a solvent‑free, dual‑cure conformal coating and a customized curing system designed to improve protection and processing efficiency. (read more)

A technical white paper examining a light and moisture dual‑cure conformal coating designed to meet low outgassing and ionic content requirements for high‑reliability electronics. (read more)

Improve protection and long‑term performance of PCB components with light‑curable encapsulants for rigid and flexible electronics. (read more)

When selecting UV curing equipment published intensity values can be misleading if working distance is overlooked. A new white paper examines how light divergence resulting from increased working distance, along with uniformity, influences delivered irradiance. It also shows why application-specific working distance is critical to reliable UV curing performance. (read more)

This educational blog answers common questions about selecting and using Dymax light-curing equipment, including spot, flood, and conveyor systems, radiometers, and accessories. Learn how to choose the right configuration, match equipment to light-curable materials, and optimize curing processes for consistent, efficient results across electronics, medical, automotive, and aerospace appl... (read more)

As electronics become smaller and more complex, adhesives and coatings play a critical role in performance, reliability, and manufacturability. This blog features insights from Dymax’s Doug Katze on material innovations addressing next-generation electronics challenges. (read more)

High-speed optical and telecommunications electronics demand precision bonding, protection, and reliability for components like transceivers, fiber optics, and modules. Dymax light-curable adhesives and encapsulants help improve throughput, secure components, and protect assemblies from mechanical stress and environmental exposure in optical and telecom applications. (read more)

Discover OP-81-LS, a low-shrinkage light-curable optical adhesive designed for precise component positioning. Supports UV/Visible and LED curing with optional low-temperature heat cure. (read more)

See how Dymax 9037-F outperformed solder and tape in an RIT study on thermocouple attachment, improving accuracy and repeatability in HDI PCB profiling. (read more)

9309-SC is a UV/Visible light-curing edgebond adhesive for ruggedizing PCB components. Ideal for shock attenuation and reinforcement of fine-pitch or leadless devices. (read more)

Light-curing technology supports sustainable manufacturing through energy-efficient curing, formulations developed without solvents, and reduced process waste. Adhesives, coatings, and equipment from Dymax help manufacturers achieve environmental goals without compromising speed, quality, or reliability. (read more)

SpeedMask® light-curable maskants protect components during surface finishing processes such as grit blasting, plating, and anodizing. Applied in one layer and cured in seconds with UV/Visible light, they replace labor-intensive wax, tape, and lacquer methods, improving throughput and reducing rework and waste. (read more)

Dymax Multi-Cure 9001-E-V3.1 cures in seconds with UV/Visible light and by heat in shadowed areas to protect delicate components from moisture, thermal cycling, and abrasion. The one-part encapsulant formulated without solvents offers strong adhesion, low modulus, and low Tg to minimize stress on wire bonds and sensitive assemblies. (read more)

GA-201 light-cures in seconds to form a soft, durable gasket in complex configurations. It resists moisture and chemicals and is designed for sealing plastic, metal, and glass enclosures, and plated surfaces. (read more)

Dymax 9773 is a light-curable adhesive designed for ruggedizing and staking critical board-level electronics. Certified to NASA ASTM E595 for low outgassing and Mil-Std 883 Method 5011 for low ionic content, it helps minimize PCB contamination and ensures reliability in extreme space environments. (read more)

Dymax 9483 is a dual-cure conformal coating that cures rapidly with UV/Visible light and continues curing through ambient moisture in shadow areas. With excellent corrosion, chemical, and heat resistance and no added solvents, it provides long-lasting protection for printed circuit boards used in harsh environments. (read more)

Dymax 9200-W Series adhesives and encapsulants are designed for assembling non-medical consumer wearables. They are formulated with low-sensitizing ingredients and deliver high-performance bonding for devices worn close to the skin. (read more)

Dymax 9803 is a fast-curing, low-shrinkage optical epoxy adhesive designed for precision bonding in camera modules, LiDAR, and PCB assemblies. It offers excellent adhesion, low outgassing, and cures with LED/UV light and low-temperature heat for shadowed areas. (read more)

Dymax light-curable adhesives deliver fast, reliable staking, ruggedizing, and wire tacking for PCB assemblies. Cure in seconds for immediate strength and superior protection against vibration and shock in electronics applications. (read more)

The BlueWave® AX-550 V2.0 LED light-curing flood lamp is compact and quiet, generating fast light curing of assembled parts in seconds. (read more)

Room-Temperature Stable Encapsulant & Wire Bond Adhesive with Secondary Moisture Cure (read more)

Low-outgassing adhesives are critical for aerospace, satellite, and defense electronics operating in vacuum and extreme environments. This Dymax blog explains what engineers need to know about low-outgassing requirements, testing standards like ASTM E595, and how light-curable materials help protect sensitive electronics while supporting fast, on-demand curing. (read more)

Our light-curable bonding materials cure in seconds upon exposure to UV or LED light.  (read more)