Micron Graded Chemical Mechanical Planarization (CMP) Slurries
2 Results
Premasol CS colloidal Silica Suspension
from Advanced Abrasives Corp.
from Advanced Abrasives Corp.
Premasol CS colloidal Silica Suspension. Premasol CS colloidal silica suspension contains spherical silica particles with an average size of 50 nm and held in a suspension with a pH range of 9-11 that is formulated to resist drying. In the event that Premasol CS is left for a long period to dry on a... [See More]
- Grading System: Micron Graded
- Form: Liquid / Dispersion; Other; Suspension
- Type: CMP / Wafer Planarization
- Compound / Abrasive Type: Silca; Ceramic
Emulsion-Base Diamond Slurries
from Precision Surfacing Solutions
from Precision Surfacing Solutions
The Lapmaster range of diamond slurries has been formulated for use on many different types of lapping plates and polishing pads. The slurries can be hand sprayed onto the lapping/polishing platen or applied by an electronic dispensing system to control cost and reduce waste. Many Lapmaster diamond... [See More]
- Grading System: Micron Graded
- Form: Slurry
- Type: Lapping; CMP / Wafer Planarization
- Compound / Abrasive Type: Diamond