Overview
Traditional high thermal die attach pastes (DAP) are typically silver- filled resin matrices which can offer high adhesion, good conductivity and high reliability. However, though providing desirable adhesion and reliability in various bonding setting, they usually cannot offer ultra-high thermal conductivity since the silver particles do not form good enough contact at the interface. On the other hand, pure silver sintering materials can easily reach thermal conductivity (TC) > 100 w/mk but usually require high pressure and temperature curing to enable silver particle sintering. These silver sintering materials have further limitations of reliability due to their porous or brittle nature and cannot be extended to larger die sizes due to high stress in bond line.
Keeping these limitations in mind, Henkel has developed a new class of materials combining the high TC performance of pure silver sintering materials and high reliability performance of resin based DAP. This technology is identified as semi-sintering or hybrid sintering paste. Webinar attendees will learn more about these new DAPs, including their excellent workability qualities and superior electrical and thermal performance.
Henkel's semi-sintering technology enables silver particles sintering synergistically with resin matrix curing, achieving an interpenetrating network (IPN) of sintered silver structure and cured resin matrix. It provides good adhesion, high toughness and high conductivity. This new semi-sintering die attach paste delivers a robust, lead-free solder alternative with best-in-class electrical and thermal performance.
Key Takeaways
- Learn about Henkel's new patent pending pressure-less semi-sintering die attach adhesive platform for power ICs and discrete to meet higher heat dissipation requirements
- Discover how these materials can be dispensed, printed and cured on standard semiconductor assembly equipment similar to current silver adhesives and soft solders
- Understand semi-sintering DAP's excellent workability, exceptional dispensing and printing, longer work life, open time, and stage time
Speaker
Yuan (David) Zhao received his Ph.D. in mechanical engineering from University of Maryland College Park. He has over 20 years of research and industrial experience and joined Henkel in 2014. Before that, he was with Rockwell Scientific/Teledyne Scientific and Imaging. In his previous work, he served as Principal Investigator (PI) or Co-PI for multiple projects sponsored by Defense Advanced Research Project Agency (DARPA) or Office of Navy Research (ONR), including Nano Thermal Interface (NTI) and Thermal Ground Plane (TGP), and collaborated with various industrial partners including Boeing, BAE Systems, Northrup Grumman and Rockwell Collins.