Gallium nitride (GaN) on silicon carbide (SiC) has the highest power density across a broad frequency range and plays a pivotal role in providing the best figure of merit for power amplifiers in terms of linear output power. This webinar will showcase MMICs, HEMTs, RF diodes, SAW solutions with best in class performance meeting the requirements of 5G, satellite communications, aerospace and defense applications. Different types of beamforming, figures of merit used in components for these applications and the key benefits will be discussed.
Overview
GaN on SiC has the highest power density across a broad frequency range and plays a pivotal role in providing the best figure of merit for power amplifiers in terms of linear output power. This webinar will showcase MMICs, HEMTs, RF diodes, SAW solutions with best in class performance meeting the requirements of 5G, satellite communications, aerospace and defense applications. Key figures of merit used in components for these applications and the key benefits will be discussed.
Different types of beamforming for mmWave -- analog beamforming, digital beamforming and hybrid beamforming -- with implementation techniques using phased arrays and metamaterial concepts will be discussed, highlighting the trade-offs and benefits of each approach.
The webinar will provide an overall understanding of GaN on SiC solutions benefits in meeting the requirements of 5G, satellite communications, aerospace and defense applications.
Key Takeaways
- Meet linearity specs for high order modulations used in 5G, satellite communications
- Explore cost effective beamforming for 5G using varactors
- Learn how to deliver higher power for avionics and L Band radar systems using GaN on SiC
- Achieve higher efficiencies for your radar systems
- Drive wider bandwidths for your MILCOM radio systems
Speakers
Mike Ziehl, Senior Manager, Product Marketing for Microchip’s RF and Microwave Product line, has more than 25 years of engineering, marketing and general management experience in the semiconductor business. He and his teams have launched innovative products that opened new market segments, driving design wins, revenue and growth in the mobility (5G), wireless infrastructure, aerospace and defense and industrial market segments. He has authored multiple articles in leading industry publications, and spoken at numerous industry events, panels and webinars. Prior to joining Microchip, Ziehl worked in the RF semiconductor industry in leadership positions at Macom, NXP and Hittite Microwave. He holds a Master’s in Business Administration (M.B.A) from Rensselaer Polytechnic Institute and a BSEE from Fairfield University.
Baljit Chandhoke is Product Manager for Microchip’s industry-leading portfolio of RF products. He has more than 15 years of product line management experience in customer facing roles leading teams defining new products, competitive positioning, driving design wins, revenue and go-to-market strategies in wireless infrastructure, mobility (5G), aerospace and defense market segments. He has authored multiple articles in leading industry publications, YouTube videos and webinars. Prior to joining Microchip, Chandhoke worked in leadership positions at GlobalFoundries, IDT, ON Semiconductor, Cypress Semiconductor. He completed his Master’s in Business Administration (M.B.A) from Arizona State University, M.S. in Telecommunications from University of Colorado Boulder and earned a Bachelors in Electronics and Telecommunications Engineering from University of Mumbai, India
Chuck Millet, Principal Engineer for Microchip’s industry-leading portfolio of RF products, has more than 20 years of product line management and applications engineering experience, including customer facing roles in account management. His roles in product management included leading teams in defining new products, determining competitive positioning, and go-to-market strategies, in automotive, wireless infrastructure (5G), healthcare, and the aerospace and defense market segments. He has authored multiple articles in leading industry publications, YouTube videos and webinars. Prior to joining Microchip, Millet worked in leadership positions at Analog Devices and completed his Master’s in Business Administration (M.B.A) from Oakland University, and Bachelors in Electrical Engineering from Northeastern University, Boston, MA.