Achim Baum will give insight into Nexperia’s power diode portfolio having a focus on efficient switching performance. This is matched by the performance of clip bond flat power packages. What are the benefits of designing in clip bond flat power packages and why is there a trend cross industries to transition from legacy packages towards clip bond flat power packages?
Overview
Nexperia offers an extensive portfolio of power diodes, including highly efficient Schottky rectifiers, hyperfast and ultrafast recovery rectifiers or silicon germanium with cutting-edge efficiency and thermal stability. These power diodes are offering the best performance in the smallest footprint.
Driven by increased requirements in efficiency, power capability and space constraints over the last years power diodes in mature packages have been replaced with more efficient clip bond flat power packages on new designs. This increased market demand is leading to a market-wide trend in package transition toward flat power packages, taking into account technical performance but also longevity and supply constrains compared to legacy packages. During the webinar the recommended replacement packages will be shown and compared with the legacy packages.
Nexperia's power diodes in clip-bonded flat power (CFP) packages combine efficient power conversion and a space-saving design. Nexperia has a clear strategy to further widen the CFP portfolio, provide capacity and support customer application designs.
Key Takeaways
- Discover Nexperia’s different power diode technologies and advantages
- Learn about market package trends for power diodes
- Explore recommended packages for transition
Speaker
Achim Baum is responsible for medium and high power silicon-based rectifiers and BJTs. Joining Nexperia in 2021 after working in distribution, he has broad experience in the component business as well as automotive and industrial applications