Learn how to connect teams across all engineering disciplines and give them best in class solutions that thrive with a collaborative approach to electronics systems design. Experience how with the help of the digital twin you can seamlessly collaborate between the MCAD and ECAD domains. Easily visualize and correct any mechanical and electro-mechanical clearance or interference violations to eliminate errors and optimize your product for form factor, quality and performance.
Overview
Design teams must deliver more complex products on ever more compressed schedules. Yet many development teams still struggle to break free of legacy practices: engineering silos, manual information exchange and incompatible toolsets. Learn how to connect your teams across all engineering disciplines and give them best in class solutions that thrive with a collaborative approach to electronics systems design.
Mechanical and electronics codesign is an integrated approach to system and product development that eliminates redundancies and rework across disciplines. This webinar will discuss and debate how to maximize engineering collaboration in real-world development processes. Experience how with the help of the digital twin you can seamlessly collaborate between the MCAD and ECAD domains. Learn how to design for manufacturing upfront to avoid possible design violations before they ever occur. Ensure your system and product is ready for manufacturing by running the assembly through design rule checks tailored for your company and/or manufacturer guidelines. Easily visualize and correct any mechanical and electro-mechanical clearance or interference violations to eliminate errors and optimize your product for form factor, quality and performance.
Key Takeaways
- Reduce errors by unifying MCAD and ECAD design teams with a common view into design data to reduce ambiguity
- Run Design for Manufacture (DFM) audit to ensure DFM constraints aren’t violated, and the finalized design can be produced at scale
- Leverage digital prototyping to reduce both development cost and design re-spins
- Allow engineers to continue work in their native environments with adaptable multi-directional workflows
- Optimize for form-factor, quality and performance with rule-based DFM for an electronics product
Speakers
Armenti has over 25 years of experience in the electronics industry. Prior to joining Siemens, he held management, technical marketing and application engineering positions at several major telecommunication and software companies including Mentor Graphics, Zuken, BlackBerry, Motorola and AT&T Bell Labs.
Arnot’s career in electronics began in the 1990’s with Hewlett-Packard in Barcelona, Spain. From 1995 he held various product management and global business development roles in the Inkjet Commercial Division before leaving in 2004 to found a wireless start-up developing social proximity applications for Facebook. From there he went on to run the U.S. operations of GreenPowerMonitor, a leading solar monitoring company. In February 2020 Arnot joined the product management team at UltraSoC, which was acquired by Siemens DISW in October 2020. In June 2022 he joined the Siemens NX team as a product marketing manager.