Every batch of electronic assemblies requires at least two things: a stencil to print solder paste through and a pick and place program to place parts. With 25 million new product introductions, that is a lot of pick and place programs as well as stencil foils that need to be created. This webinar will discuss the challenges of creating electronic assembly stencils from the experience of a stencil manufacturer and their design software partner. We recommend this webinar to process and manufacturing engineers involved in the stencil design process who would benefit from learning from a stencil vendor that produces thousands of stencils every year.
Overview
Virtually every batch of electronic assemblies requires at least two things: a stencil to print solder paste through and a pick and place program to place parts. With 25 million new product introductions, that is a lot of pick and place programs as well as stencil foils that need to be created. This webinar will discuss the challenges of creating electronic assembly stencils from the experience of a stencil manufacturer and their design software partner.
Traditionally, stencil design requires bi-directional communication between the assembler and stencil vendor, which causes delays due to the constant back and forth. Furthermore, the starting point is usually a Gerber file used to apply the overall stencil rules to. This makes it difficult to reuse those rules on other designs, and also means multiple data sets are being used across the assembly areas.
This webinar will show how to use a single product digital twin of the design across all areas of electronics assembly. We will focus specifically on the stencil design process and how to create and manage design-independent rules that can be applied for each PCB, and also use the same data to work in conjunction with the Solder Paste Inspection process (SPI). We recommend this webinar to process and manufacturing engineers involved in the stencil design process who would benefit from learning from a stencil vendor that produces thousands of stencils every year.
Key Takeaways
- Learn how intelligent CAD can significantly reduce the time to develop multiple stencils with reusable rules.
- Hear how a stencil manufacturer applies rules to package classifications to reduce the number of package specific rules.
- Streamline the overall flow of stencil design by leveraging the product digital twin used by other electronics assembly processes.
Speakers
Laing graduated with a B.Sc. in electrical and electronic engineering from Loughborough University in the U.K. He has over 25 years’ experience in PCB manufacturing with particular strengths in test and inspection methodologies with three test companies, namely Marconi Instruments in the U.K., followed by GenRad and Teradyne in the U.S. He then moved more ion to software solutions for Router Solutions Incorporated, which was acquired by Mentor Graphics Corporation in 2006. When Mentor acquired Valor Computerized Systems in 2010 he moved in that division and has been working as both a Product Marketing Manager and Business Development Manager. Laing has been granted three patents, one in the U.K. and two in the U.S, and recently filed one more. With the recent acquisition of Mentor by Siemens Digital Industries Software, he looks forward to further his career with Siemens. Laing has lived in the U.S. for over 20 years and now resides in Erie, Colorado, with his wife and two sons.
Grattard has over 20 years of experience in stencil CAD. He is currently managing the CAD team at DB Products and is responsible also for choosing the right tools for the team to enable the creation of more than 10 000 stencils per years. His motto is “Deliver the right stencil to the right customer”. Grattard also manages collaborations with universities and R&D departments to advance development of new stencil technologies.