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Microvia Reliability Stacking and Staggering for a Successful Design

Microvias are used to allow High Density Interconnections (HDI). However, designing with microvias began without a thorough understanding of the reliability of the HDI connections, especially when multiple-depth microvias were utilized. Watch this free webinar to learn from Summit's VP of Technology, Gerry Partida, when and where it is possible to stack microvias many levels deep, and where in the same design that staggering of microvias is necessary at every level.




Originally presented: April 29, 2024
Duration: 1 hour
Presented by:

Overview

Microvias have been a great enabler for allowing High Density Interconnections (HDI).  Yet, the employment of microvias began without a thorough understanding of the reliability of the HDI connections, especially when multiple depth microvias were utilized. 

The early testing methods of microvias were unable to measure the resistance of a daisy chain network at the reflow precondition process. Now, a deeper understanding is possible with the use of microvia reliability simulation tools. The simulation tools now allow a design to be vetted for the material selection, the selection of the dielectrics construction, the diameter of the microvia, and the pitch of the design.

The purpose of this presentation is to share when and where it is safe to stack microvias many levels deep, and where in the same design that staggering of microvias is necessary at every level.  This presentation will demonstrate that it is possible to use 4 stack microvias in tight pitch devices, along with staggered microvias outside the tightly pitched devices. This presentation will also demonstrate that material expansion, pitch, microvia diameter, reflow temperature, and the length of the stacked microvia, are contributing attributes to the final reliability of the microvia.

Key Takeaways

  • Learn how it is possible to use 3 or more stack microvias in tight pitch devices. 
  • Understand how to design with staggered microvias outside tightly pitched devices. 
  • Discover how material expansion, pitch, microvia diameter, reflow temperature, and the length of the stacked microvia contribute to the final reliability of the microvia.

Speaker

Gerry Partida, Vice President of Technology, Summit Interconnect

Gerry Partida is the Vice President of Technology for Summit Interconnect, the largest privately-held PCB manufacturer in North America. Gerry began his career in the Printed Circuit Board industry in 1984 at Everett Charles Test Equipment, and joined Optrotech/Orbotech in 1986. He was a member of the team that introduced CAM automation, net list compare, AOI/CAD reference to the PCB industry. His current position is focused on manufacturing cutting edge high density interconnect, high speed digital, Flex/Rigid Flex and RF/microwave printed circuit boards for military and commercial industries. He is a subject matter expert on IPC-6012, and a member of the IPC-6012 and IPC-6018 review committees. Gerry recently has become a Vice-Chair for IPC-6012/IPC-A-600 & IPC-V-TSL-MVIA Microvia Task Force.