In this webinar, we will explore how Filtronic is pushing the boundaries of SSPAs, achieving power levels that now rival TWTAs, but with significantly lower costs and longer lifespans. We will also discuss future developments in frequency bands and semiconductor technologies.
Overview
Amplifiers are a critical component in any long-range communications system. Positioned before the antenna, amplifiers boost the power of communications signals so they can be sent over long distances. Amplifiers are the most power-hungry component in RF communications systems, making them a key focus for performance optimization in terms of linearity, power output and efficiency.
The original amplifier technology used in RF communication systems was the travelling wave tube (TWT). It is well established, reliable and still widely used – particularly in higher frequency, high-power applications. TWTs are structurally complex, vacuum-based electronic devices that are complex and time-consuming to manufacture.
The challenger technology is the solid-state power amplifier (SSPA). These semiconductor-based devices can be produced quickly and in high volumes, at dramatically lower cost than tube amplifiers. However, they have not traditionally been able to compete with TWTs in higher frequency, high-power applications.
Until now, watch this webinar to find out what’s next.
Key Takeaways
- Discover the significant benefits of solid-state amplifiers, including enhanced reliability, cost-efficiency, extended longevity, and consistent repeatability.
- Explore new semiconductor processes and highlight the benefits they will bring, including improved performance, efficiency, and scalability.
- Discuss how satellite communications need to use all available frequency bands, looking at what’s next as they move into less-crowded higher frequency bands.
Speaker
Tudor Williams is a strategist in the fields of space, communications, semiconductors, and defense. At Filtronic, he collaborates closely with business development and engineering teams to shape the company’s technical strategy and roadmaps. In this role, he also manages industry and academic partnerships and secures funding for strategic roadmap projects. Williams holds a Master of Engineering (MEng) in Electronics and Communications Engineering from Swansea University and a PhD in RF/Microwave Engineering from Cardiff University. Prior to his tenure at Filtronic, he was the Technical Director at the Compound Semiconductor Applications Catapult. There, he led a multidisciplinary team of engineers specializing in power electronics, photonics, RF and microwave technology, and advanced packaging.