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Upcoming Webinar:

Powering the Future of Electrification through Reliable, High-Power High Density Modular Connectivity

As electrification drives higher power demands, conventional connectors can struggle with resistance, reliability, and lifecycle performance. Join this webinar to learn how next-generation connector solutions can support higher current, lower contact resistance, and longer service life across demanding applications.




Date: November 9, 2026
Time: 11 AM EST (8 AM PST / 5:00 PM CET)
Duration: 1 hour
Presented by:

Overview

Electrification is accelerating, and this webinar explores the trends driving the growing demand for high-power connectors in a wide range of applications. These applications include warehouse automation (AGV/AMR), railroad transportation systems, AI data centers, C4ISR/vetronics power-distribution units (PDU) for defense applications, and advanced electronic tests and measurement systems such as semiconductor burn-in tests.

Next-generation connector solutions designed to deliver higher current-carrying capacity have been developed to address this growing demand. Discover their lower contact resistance, enhanced reliability, and superior lifecycle performance compared with conventional alternatives.

Key Takeaways

  • Understand how high-power modular connectors are enabling electrification across diverse industries and applications.
  • Learn how modular connector architectures simplify system design while providing greater flexibility and scalability.
  • Discover innovative high-power contact technology that delivers proven improvements in electrical and mechanical performance.

Speaker

Joydip Sanyal, Product Line Manager, General Industrial and Aerospace and Defense, Connectors, Smiths Interconnect, a Molex company

Joydip Sanyal is a Chartered Mechanical Engineer with 18-plus years of experience in the industry. He is currently responsible for providing strategic direction for product line development, product and technology roadmap creation, and market penetration.