Driven by ever-increasing computing power requirements, demand for data center AI accelerators is experiencing unprecedented, explosive growth. However, as AI chip designs evolve rapidly through advanced architectures and ultra-large formats, they are also creating an entirely new set of challenges for mass production testing.
Overview
AI is the new engine of global growth, driving the semiconductor industry toward a massive trillion milestone by 2030.
The traditional Moore's Law is being outpaced as chip designs evolve rapidly through advanced architectures and ultra-large formats. While cutting-edge innovations in manufacturing, packaging, and blazing-fast I/O interfaces are unlocking unprecedented performance, they are also creating an entirely new set of challenges such as the interconnect wall, memory wall, and thermal wall for mass production testing.
Are your testing strategies ready for this next generation? Join our upcoming webinar to discover how to overcome these unprecedented testing hurdles and stay ahead of the curve!
Key Takeaways
- Gain a clear understanding of AI chip testing trends for 2026 and beyond.
- Discover proven testing solutions for ultra-large-scale packages, including BGA and LGA.
- Connect directly with Smiths Interconnect’s technical experts to tackle your specific testing pain points.
Speakers
Justin Bahaj holds a Bachelor’s degree in physics from Washington University in St. Louis, alongside both a Master of Science in physics and a Master of Engineering in mechanical engineering from Iowa State University. He joined Smiths Interconnect in 2017 as a Design Engineer in the semiconductor business unit. He is passionate about collaborating with diverse, multinational teams to advance cutting-edge technologies for industry-leading customers.
Joshua Daniel has nearly a decade of experience in the burn-in industry and has hands-on experience in design, manufacturing, and technical and commercial aptitudes, including in-line automation of manufacturing and development of next-gen computing device test fixtures.