This flexible heater webinar is led by Flexible Circuit Technologies industry experts to guide engineers and product teams in overcoming common challenges in flexible heater design and manufacturing. Attendees will gain practical insights into material selection, circuit design, thermal uniformity, and manufacturability — learning how to avoid costly design pitfalls, improve reliability, and accelerate time to production. Through real-world examples and expert guidance, participants will leave better equipped to translate performance requirements into robust, scalable flexible heater solutions.
Overview
Participants will gain a clear, practical roadmap for turning performance requirements into reliable, and scalable flexible heater solutions — while reducing risk, controlling costs, and avoiding production delays. Led by Flexible Circuit Technologies industry experts, this webinar helps engineers and product teams navigate common challenges in flexible heater design and manufacturing. Attendees will learn best practices in material selection, circuit layout, thermal uniformity, and design for manufacturability. Through real-world examples and expert insights, they’ll discover how to prevent costly design mistakes, enhance long-term reliability, and move from concept to production with greater speed and confidence.
Key Takeaways
- Review design considerations for optimized circuit design
- Learn how to choose the right substrate, resistive materials, and adhesives
- Discover how to achieve thermal consistency and uniform heat performance
- Examine real-world use cases in automotive systems, medical and diagnostic equipment, and beyond
- Explore emerging trends and innovations in thermal management solutions
Speakers
Mark is the Director of Application Engineering at Flexible Circuits Technologies, Inc. Mark is an internationally recognized flexible circuit expert in design, fabrication and testing of flexible and rigid flex circuits offering more than 40 years of industry expertise. He is Vice-Chair of the IPC Flexible Circuits Committee, member of IPC Technical Activities Executive Committee (TAEC), Chairman of IPC-2223 Flexible Circuit Design Committee, and is an active member on the IPC-6013, IPC-4202, IPC-4203, and IPC-4204 committees. He is a senior instructor on Flexible PCB design at IPC and PCB Design conferences. He is an established columnist for Printed Circuit Design and Fab magazines and a featured writer for SMT, Connector Specifier, Machine Design, Medial Design and more.
Chris is the Sr. Principal Applications Engineer at Flexible Circuits Technologies, Inc. Chris has 35 years of experience and expertise in the flex circuits industry. Which includes Flex and Rigid Flex design, Process Engineering, Project Management, Manufacturing, and design for manufacturability. This broad range of experience allows him to take a design from concept to creation while avoiding pitfalls along the way. He also is a member of the IPC-2223, 6013, 4202 and 4204 committees.