Power packaging is evolving fast, and the demands on die-attach reliability have never been higher. This webinar features John Hynek, Global Product Manager at MacDermid Alpha Electronics Solutions, and takes a deep dive into the Argomax Films & AccuLam portfolio — the silver sintering film family engineered for high-power, high-reliability packages.
Overview
The webinar features John Hynek, Global Product Manager at MacDermid Alpha Electronics Solutions, will take us inside the ARGOMAX® Films & AccuLam™ portfolio — a family of silver sintering films engineered for SiC die attach and high-power semiconductor packaging.
In this session, you’ll learn:
- How ARGOMAX® sinter films use highly engineered silver-based nanoparticles to create pure silver bondlines with exceptional thermal and electrical conductivity.
- The product specifications and formats — pre-cut and wafer-level film solutions, AccuLam™ 8022's 65 µm film thickness for a 20 µm nominal bondline, patterned dimensions, and customizable sheet sizes.
- How AccuLam™ pre-cut film enables lower-temperature and lower-pressure lamination, supporting faster processing and higher manufacturing throughput.
- How film-based sintering eliminates the need for conventional paste printing and drying equipment, helping reduce capital costs and manufacturing complexity.
If you work in power semiconductor packaging, SiC die attach, sintering process development, or assembly engineering — this is for you.
Lamination and sintering processes will be key topics, from film placement and die pick-and-place through final sintering.
Key Takeaways
- Discover how ARGOMAX® sinter films use highly engineered silver-based nanoparticles to create pure silver bondlines with exceptional thermal and electrical conductivity for high-reliability die and spacer attach applications.
- Learn the product specifications and formats — pre-cut and wafer-level film solutions, consistent bondline thickness control, patterned film dimensions to match process requirements, and customizable options for die or spacer attach.
- Learn how the AccuLam™ pre-cut film format enables lower-temperature and lower-pressure lamination for faster processing, improved manufacturing throughput, and compatibility with larger component sizes.
- Experience how film-based sintering eliminates the need for conventional paste printing and drying equipment, helping reduce capital investment, manufacturing complexity, and cleanroom equipment requirements.
Speaker
John Hynek is Global Product Manager for Power Electronics at MacDermid Alpha Electronics Solutions, bringing more than 20 years of experience in product management, engineering, and technology commercialization across the electronics and industrial sectors. Throughout his career, John has held product management leadership positions at several global companies, including LG Electronics, Miele, CONTA-CLIP, and Philips Lighting, where he managed professional LED product lines. His earlier experience includes applications engineering roles at Littelfuse and Philips Lighting Electronics, providing him with a strong technical foundation in electronic components and applications. At MacDermid Alpha Electronics Solutions, John focuses on advancing innovative materials for power electronics, including silver sintering and advanced die-attach technologies that support improved thermal performance, reliability, and manufacturing efficiency. His combination of technical expertise and commercial experience helps bridge emerging customer requirements with next-generation material solutions for demanding power electronics applications.