Low temperature solder solutions have been gaining interest in recent years as a technology enabler for next generation chip-scale package designs. Recent alloying advancements led to the development of the HRL3 alloy that significantly improves reliability over traditional tin-bismuth (SnBi)-based low temperature solder alloys.
The adoption of low temperature solders has been gaining traction in the electronics assembly industry in recent years due to advancements in alloy design and the potential benefits of reducing peak reflow temperatures. The benefits of reducing peak reflow temperatures, such as the reduction in dynamic warpage of sensitive package designs, the ability to use lower glass transition temperature (Tg) substrates, and reducing the exposure to thermal excursion have long been known to offer process engineers yield and cost improvements in their electronics assembly.
The evolution in low temperature alloy design has led to the development of MacDermid Alpha's HRL3 alloy which directly addresses the need for enhanced mechanical and thermomechanical reliability to meet the challenges of next generation package designs.
The ability to reduce peak reflow temperature not only improves common warpage induced defects such as bridging, head-in-pillow and non-wet open, but also improves drop shock and thermal cycling performance over existing low temperature solutions. This webinar will discuss the inherent benefits of the HRL3 alloy and how the resulting performance attributes have practical implications as an enabling technology for the future of surface mount assembly designs.
- Develop understanding of distinct differences between traditional SnBi solders and next generation low temperature solders such as HRL1
- Compare drop shock and thermal cycling data for HRL3 to baseline surface-mount technology (SMT) alloys such as SAC305
- Detail the effect low temperature solders have on warpage induced defects such as non-wet open (NWO) or head-in-pillow (HIP)
- Learn how low temperature solders have to potential to enable next generation package designs
Salerno has over 10 years of experience in the electronics assembly industry in roles such as application engineering, project management, and product management. He holds both a Bachelor of Science in Materials Engineering and an MBA in corporate finance and international marketing from Rutgers University.