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On-Demand Webinar:

Dynamic Mechanical Analysis (DMA) for Measuring Mechanical Properties and Better Understanding Your Samples

Register for this webinar to learn why dynamic mechanical analysis (DMA) is one of the most important thermal analysis techniques, and how it can help you better understand your sample.


Date: June 8, 2020
Time: 10 AM EDT (7 AM PDT / 4:00 PM CEST)
Duration: 1 hour
Presented by:

Overview

This webinar will discuss the basic principles of DMA and present some interesting application examples.

Dynamic mechanical analysis (DMA) is used to measure the mechanical properties of viscoelastic materials like thermoplastics and composites as a function of temperature or frequency when the materials are deformed under the action of a periodic force or displacement.

DMA provides quantitative and qualitative information on Young's modulus and shear modulus values, damping characteristics and viscoelastic behavior, and more. This kind of information is very important for process and application engineers, materials research scientists and physical chemists.

Key Takeaways

  • Learn the basic principles of DMA
  • Discover an overview on the 5 DMA deformation modes
  • Understand the different measurement possibilities, including temperature, frequency and amplitude
  • See application examples from different industries

Speaker

Dr. Jürgen Schawe, Senior Scientist Thermal Analysis, Mettler-Toledo, Analytical

Jürgen E. K. Schawe was awarded a Ph.D. in solid state physics in 1984. After that, Dr. Schawe worked at the University of Rostock in the Polymer Physics Group, and from 1992 to 1999 for calorimetry of the University of Ulm. Since 1999 he has worked for Mettler-Toledo AG in Schwerzenbach, Switzerland. Dr. Schawe is a senior application scientist for Material Characterization. He was awarded the 2010 STK Award of Applied Chemical Thermodynamics by the Swiss Society for Thermal Analysis and Calorimetry. To date, Dr. Schawe has published 62 articles in scientific journals and has been awarded 4 patents.