Product Announcements:
Semiconductor Wire and Wedge Bonders

Special characteristics and advantages of Suntech advanced ceramics

Product application

Because the excellent special characteristics of advanced ceramics. Super pure ceramics usually apply to the cycle of semiconductor manufacture, include semiconductor chip and chip handling, semiconductor manufacture(front-end) and semiconductor package(behind-end).... Read more...

Enhancing Soldering Quality with Wedge Capillaries Read more...

Understanding capillary aging in wire bonding, its impact on solder joint quality, and methods to mitigate deterioration for prolonged capillary life. Read more...

Ceramic capillaries are the primary tools used for wire bonding. Under the influence of pressure, heat, and ultrasonic vibration, these capillaries are used to bond wires with diameters ranging from 0.025mm to 0.050mm onto solder pads or pins. Read more...

Unlock the potential of copper wire bonding with Shangde ceramic capillaries - a game-changer in semiconductor packaging. Optimize processes, enhance reliability, and cut costs, achieving a remarkable 95% qualification rate. Read more...

Wire bonding is currently the mainstream connection method for semiconductors packaging. Commonly used wire bonding welding methods include thermocompression welding, ultrasonic welding and ultrasonic thermocompression welding. Wire bonding can be categorised as ball bonding and wedge bonding according to the shape of the welded solder joints. Read more...

In order to achieve more efficient and reliable bonding with silver alloy wire, the specially treated texture of Suntech ceramic capillary is recommended, which has been proven to enhance the coupling interface between the capillary tip surface and the silver alloy wire, providing more efficient ultrasonic energy transfer. Read more...