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Supplier: Win Source Electronics
Description: Manufacturer: SiTIME Win Source Part Number: 794426-SIT8256AI-22- 33E-156.257800T Series: SiT8256 Packaging: Reel package Type: MEMS (Silicon) Operating Temperature Range: -40°C ~ 85°C Package: 4-SMD, No Lead Mounting: SMD Frequency: 156.2578MHz
- Operating Temperature: -40 to 85 C
- Oscillation Frequency: 156 MHz
- Oscillator Type: Other
- Package / Form Factor: Surface Mount Technology (SMT), Other
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Supplier: Win Source Electronics
Description: Manufacturer: SiTIME Win Source Part Number: 794428-SIT9001AC-23- 25E3-100.00000T Series: SiT9001 Packaging: Reel package Type: MEMS (Silicon) Operating Temperature Range: -20°C ~ 70°C Package: 4-SMD, No Lead Mounting: SMD Frequency: 100MHz
- Operating Temperature: -20 to 70 C
- Oscillation Frequency: 100 MHz
- Oscillator Type: Other
- Package / Form Factor: Surface Mount Technology (SMT), Other
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Supplier: Win Source Electronics
Description: Manufacturer: SiTIME Win Source Part Number: 794423-SIT8209AI-32- 33E-125.003750T Series: SiT8209 Packaging: Reel package Type: MEMS (Silicon) Operating Temperature Range: -40°C ~ 85°C Package: 4-SMD, No Lead Mounting: SMD Frequency: 125.00375MHz
- Operating Temperature: -40 to 85 C
- Oscillation Frequency: 125 MHz
- Oscillator Type: Other
- Package / Form Factor: Surface Mount Technology (SMT), Other
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Supplier: Win Source Electronics
Description: Manufacturer: TDK InvenSense Win Source Part Number: 776805-INMP504ACEZ-R 7 Series: INMP504 Packaging: Reel package Type: MEMS (Silicon) Termination: Solder Pads Impedance: 200 Ohm Frequency Range: 100Hz ~ 20kHz Output Type: Analog Shape: Rectangular
- Frequency Response: 100 to 20000 Hz
- Impedance: 200 ohms
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
in Powerchip's fab in Hsinchu, Taiwan. Memory bulletin: Taiwan's DRAM suppliers bet on 2007 Taiwans club of second-tier DRAM suppliers is betting big on a strong memory market in 2007, as evidenced by the flurry of announcements regarding billion-dollar investments and deals to expand production. Taiwan's
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
interview. Memory bulletin: Taiwan's DRAM suppliers bet on 2007 Taiwans club of second-tier DRAM suppliers is betting big on a strong memory market in 2007, as evidenced by the flurry of announcements regarding billion-dollar investments and deals to expand production. Taiwan's DRAM makers bet on strong
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. STMicro to introduce MEMS-based microactuator for disk drives SAN JOSE -- During next week's Diskcon USA trade show here, STMicroelectronics plans to unveil a prototype rotational microactuator, which is fabricated with microelectromechanical system (MEMS) technology and designed for greater
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
New EDA efforts could kill standard-cell design methodologies Transmeta's Crusoe processor wins support among Taiwan's mobile systems houses MEMS tool maker buys Coyote to gain 3-D design analysis capability Mulith applies radical lithography concept to mask making NanoPierce, Simotec to implement
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Cypress CEO says communications focus will drive growth Silicon Motion graphics subsystem in Panasonic notebook U.S. buys Plasma-Therm system for MEMS R &D ESI ships second 300-mm memory yield system to Semiconductor300 AMD adopts TEL's cobalt silicide etcher for Fab 25 Applied ships 100th CMP tool
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
TSMC pushes out 'risk production' for 90-nm process SAN JOSE -- Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) late today disclosed it has re-defined and pushed out the "risk production " schedule for its 90-nm process technology. In April, TSMC originally announced plans to move into "risk
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Rhines: DFM technology best bet for EDA growth TSMC to move into 'full production' at 90-nm in Q4 SIA forecast could stall equipment market, says research firm Japan draws up next national five-year R &D plan TSMC CTO Hu to resign and rejoin academia Applied Materials under investigation in Taiwan
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Semiconductor Alert! for April 3-7 IBM, eMagin to jointly develop organic LEDs for microdisplays MEMS teams with Rose Research to form new optical venture G.Lite advocates, seeing slow take-off of standard, begin to support ADSL On Semi begins integrating Cherry semiconductor unit TI takes
More Information Top
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Development and Commercialization of MEMS in Taiwan a Bumpy Exciting Experience
Taiwan MEMS industry activity begins at about the turn of the century, when government has put resources into the support of the development for the new industry for 6-8 years.
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IEEE SmartGridComm 2012 To Address Worldwide Energy Infrastructure Issues From November 5 - 8 2012 In Tainan City Taiwan
On the following morning, the conference’s three-day plenary and technical schedule will begin with the welcoming address of Dr. Chih-Kung Lee (C.K. Lee), President of the Institute for Information Industry and Vice Chairman of the SEMI Taiwan MEMS Committee.
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Electromigration Characteristic of SnAg_3.0Cu_0.5 Flip Chip Interconnection
He holds eight U.S. and 29 Taiwan MEMS /Electronic Pack- aging Device Patents.
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Investigation of the Trace Line Failure Mechanism and Design of Flexible Wafer Level Packaging
Prof. Chiang holds six U.S. and 25 Taiwan MEMS /electronic packaging device patents.
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Interfacial Fracture Analysis of CMOS Cu/Low-k BEOL Interconnect in Advanced Packaging Structures
He holds six U.S. and 25 Taiwan MEMS /Electronic Packaging Device Patents.
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Interfacial Fracture Investigation of Low-k Packaging Using J-Integral Methodology
He holds five U.S. and 24 Taiwan MEMS /Electronic Packaging Device Patents.
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A Novel Design Structure for WLCSP With High Reliability, Low Cost, and Ease of Fabrication
He holds five U.S. and 24 Taiwan MEMS /Electronic Packaging Devices patents.
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Design, Analysis, and Development of Novel Three-Dimensional Stacking WLCSP
He holds five U.S. and 20 Taiwan MEMS /Electronic Packaging Device Patents, and has six U.S. and 11 Taiwan MEMS/Bio/Electronic Packaging/Optical Device patents pending.