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Supplier: Aries Electronics, Inc.
Description: FEATURES Pressure-mount plunge to board interposer Multiple configurations: MLF, QFN, CSP, BGA, MSOP, QSOP, QFP, and more Very low inductance per contact site High cycle life with easy maintenance Manual or Automated Handler applications
- Contact Plating: Gold Plating
- Contact Resistance: 20 milliohms
- Contacts Pitch: 0.3200 mm
- Current Rating: 4 amps
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Supplier: Aries Electronics, Inc.
Description: testing and burn-in). Excellent choice for low-cost hand test applications MECHANICAL CONTACT LENGTH (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays
- Contacts Pitch: 2.54 mm
- Features: Clamshell Socket
- Operating Temperature: -67 to 392 C
- Package Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket, Other
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Supplier: Aries Electronics, Inc.
Description: CSP/µBGA Test & Burn-In Socket for Devices up to 13mm Square Chinese FEATURES For Test & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices. Consult factory for QFP applications Any
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contacts Pitch: 5.08 to 20.32 mm
- Features: Solderless, Clamshell Socket
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Supplier: Aries Electronics, Inc.
Description: FEATURES Any grid size pitch available from 0.20mm Socket lid nests device into socket for a reliable connection Suitable for prototyping, test, or burn-in of CSP, BGA, µBGA and LGA devices ZIF style socket using Aries solderless, Au-plated pressure
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contacts Pitch: 5.08 to 20.32 mm
- Features: Solderless
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Supplier: Nikon Metrology
Description: NEXIV can be optimally used for measurements of a variety of bump heights on advanced IC packages such as wafer-level CSP, as well as for the inspection of highly complicated structures of MEMS and probe card. Key benefits Simultaneous wide-area height measurement with Nikon
- Applications / Capabilities: Electronics or Semiconductor Inspection, Production & Quality Control
- Image Source: Optical Microscope
- System Type: Turnkey / Complete System
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Supplier: Ushio America, Inc.
Description: contraction, greatly reducing the deviation in alignment. APPLICATIONS FC-BGA FC-CSP Interposer 2.1D 2.5D Packaging Semiconductor post-processing RDL Passivation TSV TSV bottom hole Printed circuit board
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Fabrication of CSO Interposer Using 96% Alumina Substrate
FABRICATION OF CSP INTERPOSER USING 96% ALUMINA SUBSTRATE .
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Applications of newly developed positive photosensitive block co-polyimides to CSPs
In this paper, the first applications to CSP interposer (CSP-IP) processes by newly .
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Packaging properties of ALIVH-CSP using SBB flip-chip bonding technology
The ceramic substrate with high CTE for the CSP interposer has been already researched [7].
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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
… procedures for underfilling a CSP soldered onto a board consists of dispensing liquid underfill along one or more edges of the CSP perimeter such that capillary action forces the underfill to fill the entire space between the CSP interposer and the PWB.
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ZMFAD2004P022
… used procedures for underfilling a CSP soldered onto a board consists of dispensing liquid underfill along one or more edges of the CSP perimeter such that capillary forces the underfill to fill the entire space between the CSP interposer and the PWB.
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F2-cPACTM-a manufacturing process for a low cost CSP
Table 2: Advantages of Fex as an CSP Interposer .
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Encapsulated double-bump WL-CSP: design and reliability
The CSP interposer or substrate is replaced by redistribution of the bondpads into an area array and encapsulation of the bumped wafer.
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Reliability of lead free solder joint by using chip size package
Crack propagated through the solder bump close to land of CSP interposer on each case as shown in Fig. 4.
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Area Array Packaging Handbook: Manufacturing and Assembly > COMPLIANT IC PACKAGING
The flexible link serves to make reliable electrical and mechanical interconnection between the chip and the flexible CSP interposer .
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Lead-free technologies for electronic equipment assembly
Gold stud bumped FC is dipped in the adhesive, placed on CSP interposer , cured and underfilled.