About this eNewsletter
Frequency: 26 issues/year
Description: Engineering360's Electronic Components Newsletter offers subscribers a variety of information on electronic design products and processes for application in computers, communications equipment, consumer electronics, and industrial systems. Topics included in this publication include circuit boards, active and passive devices, signal conditioning components, and interconnect devices to solve practical problems.
Markets Served: Market Served: Automotive; Aerospace & Defense; Communications; Consumer Products and Electronics; Computers
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Covering the technologies, products and data that power aircraft, drones, spacecraft and satellites.
Alternative & Renewable Energy
Renewable energy news and features cover solar, wind, hydroelectric and other alternative energy technologies.
Design, performance and component trends for consumer, commercial and medical appliances are tracked.
Focuses on new developments in the automotive space including electric and self-driving vehicles as well as autonomous trucks and other emerging means of transportations such as eBikes and scooters.
Defense & Security Technology
Offers readers the latest on the defense and security realm, including military, cyber security, data privacy, personal security and everything in between.
Offers information on interface many kinds, including LED and LCD displays, touchscreens, flat panels, interfaces, work stations and more.
Electronic Design Solutions
The latest news, data and technologies that help electronics engineers design and select innovative components, systems and products for consumer and industrial markets. Stay informed about advances in electronic hardware and embedded software.
Light & Laser
The latest news and analysis into laser technologies and the manipulation and distribution of light such as emerging LEDs and their uses across a variety of industries.
Sensing TechnologiesSee More
News, features, products and analysis about the latest MEMS, sensors and switches and their use in emerging and established technologies.
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Past Issues of this eNewsletter
Volume 18 - Issue 25 - 12/06/2023
Customized test and measurement accessories made in the USA; The secrets of a closed loop, sensorless, sine wave BLDC motor controller unveiled; Webinar: Adopting eFuses for zonal control units; Feedback loop compensation of a current-mode flyback converter with optocoupler; How to choose the right antenna; Radiation tolerant space compute intensive module
Volume 18 - Issue 24 - 11/15/2023
Tech etch EMI and RFI shielding solutions; Your trusted source for quality electronic components; AxiForce — protect future technologies effectively; SourceToday top electronics component distributor; PJ-201 series by Components Corp; Film capacitors
Volume 18 - Issue 23 - 11/01/2023
u-blox SARA-R510AWS LTE-M AWS IoT ExpressLink module; Rapid, low-temperature UV-curing improves production rates and quality; Silver-filled epoxy for die-attach applications; MLPS flatpack, low-profile, aluminum electrolytic capacitor, 10,000 hours at 105 °C; Electrocube capacitor series offers rugged alternative to electrolytic capacitors
Volume 18 - Issue 22 - 10/18/2023
Reduce PC board assembly time with Peel-A-Way® carriers; IoT small plastic case; SMT and THM maxi "auto" blade fuse holders; Latest IGBTs and SiC for bidirectional inverters with coupled battery storage
Volume 18 - Issue 21 - 10/04/2023
BMS signal isolation transformer; The key to sector coupling: Energy storage from phoenix contact; Ultimate cooling by air — EVAC module; Choosing inductors for energy efficient power applications; Rare earth magnets
Volume 18 - Issue 20 - 09/20/2023
Custom vs standard: Which option is right for your transformer?; Reduce PC board assembly time with Peel-A-Way® carriers; Molex wire to board solutions: Mini-fit series; Long life 85/85 THB X1/X2/Y2 film capacitors for harsh environments; Lacing cords and tapes; Overcome the limitations of quartz OCXOs with SiTime's Epoch OCXO; Major distributor of China semiconductors; Solution for display testing in AR and VR headsets
Volume 18 - Issue 19 - 09/06/2023
OPTA, the PLR which takes ease of programming, integration and innovation to a whole new level; Ultra-low-profile electrolytic is the world's thinnest at just 2.2 mm; Crystal and oscillator PCB design considerations
Volume 18 - Issue 18 - 08/23/2023
How to build a custom resistive load bank; Connections that last — sealed connector solutions; Connector series benefits from 360° EMC backshells
Volume 18 - Issue 17 - 08/16/2023
AURIX™ TC375 Lite Kit; Series A and B subminiature toggles; Introducing conduit clamps
Volume 18 - Issue 16 - 08/02/2023
Intel® E810-XXVDA2 Ethernet network adapter; Automotive connector strategies and solutions for space reduction; Magnetic wire management
Volume 18 - Issue 15 - 07/19/2023
How to protect electronics, enclosures and sensors from tampering, misuse; Introducing HellermannTyton conduit clamps; Heat can quickly take down your best electrical component designs.; Package transition in power diodes
Volume 18 - Issue 14 - 07/05/2023
From SiC to thin SiC: Pushing power diodes to the next level; Addition-cured silicone resists thermal cycling and shock; High performance 3M™ crimp terminals
Volume 18 - Issue 13 - 06/28/2023
Precision timing made easy with u-blox; Enabling miniaturization with micro 3D printing; 50% off overstocked electrical test accessories, made in USA
Volume 18 - Issue 12 - 06/21/2023
IP68/IP67 network plastic box; Reduce PC board assembly time with Peel-A-Way® carriers; Digitize and automate inspection; Easy access to Asian supply chain sources; Long life, 85/85 THB-rated support industrial capacitors for harsh environments; Electronic chip or microprocessor MCU chip supply
Volume 18 - Issue 11 - 06/07/2023
UV curing and IR heat improve electronic component production quality; Q-secure locking power cords; Connect with confidence; Standard supercapacitor modules for 9V, 18V and 30V outputs; Amphenol 2M series solution for tactical robots
Volume 18 - Issue 10 - 05/17/2023
OPT3005DTS evaluation module; How to protect mission-critical equipment from tampering; damaging contaminants; Pixel-to-pixel inspection (and correction) ensures visibly perfect displays; AxiForce — Protect future technologies effectively; Ultra-low phase jitter differential output crystal oscillators for 10 Gbit Ethernet; Permanent magnets
Volume 18 - Issue 9 - 05/03/2023
The best high-performance fasteners for aerospace and defense electronics; New 10000 series DC power supplies and Loads: No lead times!; Precision multicoax connector lines; Video: Epoxy system for dam and fill applications; New slide-in and SMT battery contacts
Volume 18 - Issue 8 - 04/19/2023
Revitalize your systems — spares and repairs; Next-generation aluminum universal enclosure!; Powerful EMC filter simulation with SPICE; Single-chip, nine-axis sensor with embedded sensor fusion; B2B component distribution — 1,000+ brand-name suppliers
Volume 18 - Issue 7 - 04/05/2023
eBook download: Design Considerations for Current Sense Transformers; Accuride EZ-Release kit; Adhesives and sealants your electronics need!
Volume 18 - Issue 6 - 03/15/2023
IoT small plastic case for your IoT applications!; Reduce PC board assembly time with Peel-A-Way® carriers; Long life, 85/85 THB-rated AC filter capacitors for harsh environments; Is your specialty interconnect assembly the most important component?; Weather outside is frightful, but TE's sealed connectors are reliable
Volume 18 - Issue 5 - 03/01/2023
Versatility and utility in a handheld enclosure; Molex quad-row board-to-board connectors; RadioCarbon high-power SDR with DPD development platform from Richardson RFPD; Support a wide variety of designs with TE spring fingers
Volume 18 - Issue 4 - 02/15/2023
NXP semiconductors OM-SE050ARD-E development kit; Flexible test lead for diagnostics; manufactured in the USA; Directly buy electronic components online from Asia.
Volume 18 - Issue 3 - 02/01/2023
Improve durability and production rates with UV and IR processes; Make human electronics inspection consistent and reliable; Standard TPE power retractile cords for most applications; Ultra-low-profile electrolytic is the world's thinnest at just 2.2 mm
Volume 18 - Issue 2 - 01/18/2023
eBook download: Guide to Inductors; Integrated test solutions for 5G, data centers and high-speed test applications; Keeping your most vital systems up and running; Rare Earth magnets
Volume 18 - Issue 1 - 01/04/2023
How to select space processing devices for in-orbit edge computing applications; Simulation driven design for electronics
Volume 17 - Issue 24 - 12/21/2022
Solving for multiple design challenges with a single connection; Finding success using off-the-shelf hardware in custom electronics
Volume 17 - Issue 23 - 12/07/2022
Get price & availability forecasts for critical components; Understanding the basics of analog design; AxiForce — Protect future technologies effectively.; Watch our data converters demonstrations introduced at Electronica 2022!
Volume 17 - Issue 22 - 11/16/2022
nRF21540 DB Development Bundle (DB); New slide-in/SMT battery contacts; Take a deep space tour
Volume 17 - Issue 21 - 11/02/2022
Insulation piercing harness-board connector on a threaded post; See the guts of the iPhone 14; Using a staking compound on a circuit board; CDE...your source for AC resonant and harmonic filter capacitors; Quartz-based MultiVolt oscillators
Volume 17 - Issue 20 - 10/19/2022
Exhibit at Electronica Show; The new 2022–2024 enclosure catalog available now!; Sealed protection when you need it most; Major distributor of China semiconductors
Volume 17 - Issue 19 - 10/05/2022
fanSINKS cool hot components in sizes from 27 mm to 84 mm; RAF NAS spacer and standoff manufacturing; Customized membrane switches and keypads; Optimal for high-speed MOSFETs sockets that support 4 terminals; SA5 — Allows 350 W for AMD SP5 CPU series
Volume 17 - Issue 18 - 09/21/2022
RAF NAS spacer and standoff manufacturing; Auxiliary supply for SiC/GaN gate driver systems; Design simultaneous multiband transmitter from L to Ku band; Lacing cords and tapes; System-level connectivity management and verification of 3D IC heterogeneous assemblies; Quality and speed with DIMM and SODIMM; Demonstration of QLS1046-Space boot sequence
Volume 17 - Issue 17 - 09/07/2022
Reduce PC board assembly time with Peel-A-Way® carriers; Improve high-power RF performance with CDE mica capacitors; Connect your vehicle with TE trigger covert under-dash antennas; Demo: Microwave ADC-DAC Digital Optical Harness PoC for remote architecture
Volume 17 - Issue 16 - 08/17/2022
High-fiber density in a relatively small, circular connector package; Radiation mitigation techniques for digital processing space products; Quartz crystal vs MEMS oscillators performance based on real applications; Connectivity in one click with Blind-Mate coaxial products
Volume 17 - Issue 15 - 08/03/2022
KEMET T520 polymer tantalum KO-CAP capacitors; Secure Intel Xeon D-1700, D-2700 SBCs for mission-critical applications; High-performance, subminiature connectors; Supply NdFeB magnets in wide range of shapes, sizes and grades; DKIV-1: High current vertical mount chokes are compact; G9KB PCB power relays 600 VDC, 50 A; Key antenna considerations in designing your smart ecosystem
Volume 17 - Issue 14 - 07/20/2022
Overcoming the design challenges of wearables and hearables; Addition-cured silicone resists thermal cycling and shock; Image sensor sockets for manual evaluation/handler/burn-in/mass-production; Technology webinar : Key EMC considerations to maximize performance and compliance
Volume 17 - Issue 13 - 07/06/2022
Molex Triton Grounding Jumper Straps; Molex PowerPlane Busbar power connectors; Molex EXTreme Guardian HD power connectors; Molex vertical PowerPlane Busbar power connectors; Molex PowerPlane Busbar power connectors
Volume 17 - Issue 12 - 06/15/2022
IP68 high-performance, waterproof, plastic enclosure launched!; Get repeatable, consistent, electrical connections with PEM® eConnect™ fasteners; Solve your connector-to-connector challenges; Discover ADX4 IP to improve RF-performance of ADC EV12AQ600/605; Secured NFC transactions and payments with wearables; Bivar's SZ series with Zero Light Bleed™ technology; Demonstration of DDR4 with XILINX Kintex ultrascale FPGA
Volume 17 - Issue 11 - 06/01/2022
JAE MA01 series 8 Gbps+ high-speed, floating contact board-to-board connectors; Connect with the Advanced® tool box; Protect electronics with razor thin damping; Hybrid LIC supercapacitors deliver up to 220 farads at 3.8 Volts; Schurter's HCF series high-current, solid-state SMD fuse size 3220; Payment with wearables: opportunities and challenges; Succeed in compute intensive space use-cases with radiation tolerant solutions
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