Electronic Components News
From GlobalSpec - a leader in industrial and engineering product news and information.About this eNewsletter
Frequency:
26 issues/year
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GlobalSpec's Electronic Components newsletter covers advancements in semiconductors, passive components, and connectors, emphasizing their roles in industries like telecommunications, consumer electronics, and automation. It also explores emerging trends, offering engineers a comprehensive view of the rapidly evolving electronic components landscape.
Markets Served:
Market Served: Automotive; Aerospace & Defense; Communications; Consumer Products and Electronics; Computers
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Archives
Past Issues of this eNewsletter
Volume 19 -
Issue 19 -
09/04/2024
Hazardous location enclosure cooling solutions; 3M polyimide film tape's versatile applications; Advanced diecast enclosures for measurement and control electronics
Volume 19 -
Issue 18 -
08/28/2024
Optimizing microvia reliability in high-density circuit boards; Enhancing resin 3D printing success using RFID traceable workflow and advanced software features; The future of engineering research is here; Protect electronic components with customized silicone solutions
Volume 19 -
Issue 17 -
08/21/2024
Webinar: GaN innovations for next-level system performance; 3M™ Scotchlok™ Insulation Displacement Connectors
Volume 19 -
Issue 16 -
08/07/2024
How to interpret SiC MOSFET datasheet parameters: Apply them in a typical power electronics circuit design; Advanced connectivity for industrial applications; On-demand webinar: Using NanoAir10 to tell the full story of particle contamination in ultra clean environments; Sealed SMART-BOX protects industrial electronics; Drowning in endless technical searches?
Volume 19 -
Issue 15 -
07/17/2024
STMicroelectronics STM32WBA55G-DK1 discovery kit; Webinar: Waveguide 101 — Exploring the path to Sub-THz
Volume 19 -
Issue 14 -
07/03/2024
Say goodbye to unverified info – Meet our AI Assistant!; How to deploy high-speed cable assemblies for high-performance computing
Volume 19 -
Issue 13 -
06/26/2024
PCB terminal blocks provide valuable electronic interconnections; Webinar: New way to future-proof secured smart home devices — how to make Matter on-boarding easy
Volume 19 -
Issue 12 -
06/20/2024
IP68 high performance waterproof enclosure; Make confident decisions with verifiable answers; Measuring temperature of the smallest, complex structures of components?; ColorEasyDuino development board
Volume 19 -
Issue 11 -
06/05/2024
Improve electronic component production with UV curing processes; Everything you need to hook up everything; Type ALH AC filter capacitors for harsh environments; NM180100, a low energy LoRa/Bluetooth 5 module; Increasing the lifespan and reliability of electronic components; The latest model of component service provider with technical communication
Volume 19 -
Issue 10 -
05/15/2024
Effortlessly increase bandwidth throughput; A guide to protecting electrical enclosures; AxiForce — protect future technologies effectively
Volume 19 -
Issue 9 -
05/01/2024
eBook download: Basic Electronics Principles; Thermal management of QLS1046 space-processing module; Flexible circuits are a critical component of your product!
Volume 19 -
Issue 8 -
04/17/2024
IP67 key-fob plastic enclosure; Nano 360® Circular Connectors; Accuride's 301 series is an overachiever with a low profile; MCX N94x MCUs: Bringing more intelligence to the edge; Permanent magnets; C16 ultra miniature crystal offers tight stability
Volume 19 -
Issue 7 -
04/03/2024
MCX A series FRDM development boards; Signal conditioning for sensor applications; Thermally conductive, electrically non-conductive, low outgassing epoxy; What are temperature controlled oscillators (TCXOs)?
Volume 19 -
Issue 6 -
03/20/2024
IP68 high performance waterproof enclosure; Performance of counter-rotating fans with significant energy and noise reductions; 85/85 THB-rated MXT suppression capacitors for harsh environment; One part, die attach epoxy features high Tg; B2B component distribution — 1,000+ brand name suppliers; SpecTrax Lite is now svailable on our platform; Direct microwave conversion capabilities now made possible deep into the Ka-band
Volume 19 -
Issue 5 -
03/06/2024
Fully concealed fastening solutions: PEM® GHOST™ Fasteners; Less scrap, less handling and less risk of damage; Low-energy, long range: Download this tech paper to integrate Panasonic Industry PAN1781 seamlessly; Miniature C1E crystal now with extended frequency up to 96 MHz; Programmable quartz crystal oscillators with wide frequency and super-fast delivery
Volume 19 -
Issue 4 -
02/21/2024
Save space with THA thinpack capacitors; IoT devices and Wi-Fi 6E — Explore the benefits and key antenna selection considerations of Wi-Fi 6E for IoT; Process panel control made simple; Zero torque power distribution blocks; MSM II: The next generation pushbutton switch
Volume 19 -
Issue 3 -
02/07/2024
How AI is transforming electronics manufacturing; New high current interconnect (HCI) connector system
Volume 19 -
Issue 2 -
01/17/2024
Custom vs standard: Which option is right for your transformer?; Amphenol FCI MezzoStak® flexible printed circuit assembly; Economical outdoor network box; High temperature lead wire/nickel plated copper; KOA speer wide terminal resistors provide higher power ratings; Direct microwave conversion now made possible deep into the Ka-band
Volume 19 -
Issue 1 -
01/03/2024
Explore push-in terminal block PCB connectors; Optimizing connector solutions for DC fast charging and component interconnects in electric vehicles
Volume 18 -
Issue 26 -
12/20/2023
Custom wire harness solutions; Bringing AI to electronics assembly inspection; XW4M/XW4N dual spring connector
Volume 18 -
Issue 25 -
12/06/2023
Customized test and measurement accessories made in the USA; The secrets of a closed loop, sensorless, sine wave BLDC motor controller unveiled; Webinar: Adopting eFuses for zonal control units; Feedback loop compensation of a current-mode flyback converter with optocoupler; How to choose the right antenna; Radiation tolerant space compute intensive module
Volume 18 -
Issue 24 -
11/15/2023
Tech etch EMI and RFI shielding solutions; Your trusted source for quality electronic components; AxiForce — protect future technologies effectively; SourceToday top electronics component distributor; PJ-201 series by Components Corp; Film capacitors
Volume 18 -
Issue 23 -
11/01/2023
u-blox SARA-R510AWS LTE-M AWS IoT ExpressLink module; Rapid, low-temperature UV-curing improves production rates and quality; Silver-filled epoxy for die-attach applications; MLPS flatpack, low-profile, aluminum electrolytic capacitor, 10,000 hours at 105 °C; Electrocube capacitor series offers rugged alternative to electrolytic capacitors
Volume 18 -
Issue 22 -
10/18/2023
Reduce PC board assembly time with Peel-A-Way® carriers; IoT small plastic case; SMT and THM maxi "auto" blade fuse holders; Latest IGBTs and SiC for bidirectional inverters with coupled battery storage
Volume 18 -
Issue 21 -
10/04/2023
BMS signal isolation transformer; The key to sector coupling: Energy storage from phoenix contact; Ultimate cooling by air — EVAC module; Choosing inductors for energy efficient power applications; Rare earth magnets
Volume 18 -
Issue 20 -
09/20/2023
Custom vs standard: Which option is right for your transformer?; Reduce PC board assembly time with Peel-A-Way® carriers; Molex wire to board solutions: Mini-fit series; Long life 85/85 THB X1/X2/Y2 film capacitors for harsh environments; Lacing cords and tapes; Overcome the limitations of quartz OCXOs with SiTime's Epoch OCXO; Major distributor of China semiconductors; Solution for display testing in AR and VR headsets
Volume 18 -
Issue 19 -
09/06/2023
OPTA, the PLR which takes ease of programming, integration and innovation to a whole new level; Ultra-low-profile electrolytic is the world's thinnest at just 2.2 mm; Crystal and oscillator PCB design considerations
Volume 18 -
Issue 18 -
08/23/2023
How to build a custom resistive load bank; Connections that last — sealed connector solutions; Connector series benefits from 360° EMC backshells
Volume 18 -
Issue 17 -
08/16/2023
AURIX™ TC375 Lite Kit; Series A and B subminiature toggles; Introducing conduit clamps
Volume 18 -
Issue 16 -
08/02/2023
Intel® E810-XXVDA2 Ethernet network adapter; Automotive connector strategies and solutions for space reduction; Magnetic wire management
Volume 18 -
Issue 15 -
07/19/2023
How to protect electronics, enclosures and sensors from tampering, misuse; Introducing HellermannTyton conduit clamps; Heat can quickly take down your best electrical component designs.; Package transition in power diodes
Volume 18 -
Issue 14 -
07/05/2023
From SiC to thin SiC: Pushing power diodes to the next level; Addition-cured silicone resists thermal cycling and shock; High performance 3M™ crimp terminals
Volume 18 -
Issue 13 -
06/28/2023
Precision timing made easy with u-blox; Enabling miniaturization with micro 3D printing; 50% off overstocked electrical test accessories, made in USA
Volume 18 -
Issue 12 -
06/21/2023
IP68/IP67 network plastic box; Reduce PC board assembly time with Peel-A-Way® carriers; Digitize and automate inspection; Easy access to Asian supply chain sources; Long life, 85/85 THB-rated support industrial capacitors for harsh environments; Electronic chip or microprocessor MCU chip supply
Volume 18 -
Issue 11 -
06/07/2023
UV curing and IR heat improve electronic component production quality; Q-secure locking power cords; Connect with confidence; Standard supercapacitor modules for 9V, 18V and 30V outputs; Amphenol 2M series solution for tactical robots
Volume 18 -
Issue 10 -
05/17/2023
OPT3005DTS evaluation module; How to protect mission-critical equipment from tampering; damaging contaminants; Pixel-to-pixel inspection (and correction) ensures visibly perfect displays; AxiForce — Protect future technologies effectively; Ultra-low phase jitter differential output crystal oscillators for 10 Gbit Ethernet; Permanent magnets
Volume 18 -
Issue 9 -
05/03/2023
The best high-performance fasteners for aerospace and defense electronics; New 10000 series DC power supplies and Loads: No lead times!; Precision multicoax connector lines; Video: Epoxy system for dam and fill applications; New slide-in and SMT battery contacts
Volume 18 -
Issue 8 -
04/19/2023
Revitalize your systems — spares and repairs; Next-generation aluminum universal enclosure!; Powerful EMC filter simulation with SPICE; Single-chip, nine-axis sensor with embedded sensor fusion; B2B component distribution — 1,000+ brand-name suppliers
Volume 18 -
Issue 7 -
04/05/2023
eBook download: Design Considerations for Current Sense Transformers; Accuride EZ-Release kit; Adhesives and sealants your electronics need!
Volume 18 -
Issue 6 -
03/15/2023
IoT small plastic case for your IoT applications!; Reduce PC board assembly time with Peel-A-Way® carriers; Long life, 85/85 THB-rated AC filter capacitors for harsh environments; Is your specialty interconnect assembly the most important component?; Weather outside is frightful, but TE's sealed connectors are reliable
Volume 18 -
Issue 5 -
03/01/2023
Versatility and utility in a handheld enclosure; Molex quad-row board-to-board connectors; RadioCarbon high-power SDR with DPD development platform from Richardson RFPD; Support a wide variety of designs with TE spring fingers
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