Programmable Unijunction Transistors (PUT) Specifications

Help with Programmable Unijunction Transistors (PUT) specifications:

Performance

	VGKF		This is the maximum gate-to-cathode forward voltage.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	IT		This is the maximum DC forward anode current.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	IGAO		This is the gate-to-anode leakage current.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	VT		This is the maximum offset voltage.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	Valley Point Current (IV)		This is the value of the emitter current that produces the minimum voltage (VV) before reaching saturation..
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	Peak Point Emitter Current (IP)		This is the value of the emitter current that produces the maximum voltage (VP).
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	Pd		Pd is the power dissipated by the device while in the on-state.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	TJ		Temperature junction (TJ) is the full-required range of ambient operating temperatures.
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

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Package

	IC Package Type
	Your choices are...
	DIP / CDIP / PDIP		Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board. Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade. Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
	DPAK		Discrete package or deca-watt (DPAK).
	D2PAK		D2PAK is large surface mounted package that include a heat sink.
	IPAK		Integrated package (IPAK).
	I2PAK		I2PAK is a plastic package with three leads.
	PPAK		Power packaging (PPAK).
	MELF		Metal electrode leadless face (MELF) component diodes have metallized terminals at each end of a cylindrical body. MELF components are designed to fit the same footprints as flat components. MELF packages are available on plastic tape and reel.
	DO-15		DO-15 is a diode outline (DO) package.
	DO-35		DO-35 is a diode outline (DO) package.
	SOD		Small outline diode (SOD) package.
	SOT3		SOT3 is a small outline transistor (SOT) package.
	SOT223		SOT223 is a plastic, surface mounted, small outline transistor (SOT) package with four leads and a heat sink.
	TO-3		TO-3 is a transistor outline (TO) package with three leads.
	TO-3P		TO-3P is a transistor outline (TO) package with three leads.
	TO-39		TO-39 is a transistor outline (TO) package.
	TO-92		TO-92 is a transistor outline (TO) package.
	TO-202		TO-202 is a transistor outline (TO) package.
	TO-220		TO-220 is a transistor outline (TO) package.
	TSOP		Thin small outline package (TSOP) is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	TSOJ		Thin small outline J-leaded package (TSOJ).
	Other		Other unlisted, specialized or proprietary packages.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
	Pin Count		The number of physical connection points (e.g., pins, pads, balls) on the package.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.
	Number of Thyristors in Package		The number of diodes embedded in the chip (package).
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

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Standards and Certifications

	RoHS Compliant		Restriction of Hazardous Substances (RoHS) is a European Union (EU) directive that requires all manufacturers of electronic and electrical equipment sold in Europe to demonstrate that their products contain only minimal levels of the following hazardous substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyl and polybrominated diphenyl ether. RoHS will become effective on July 1, 2006.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.
	ELV Directive		End of Life Vehicles (ELV) is an EU directive that required certain automotive products to be free (except for trace impurities) of mercury, cadmium and lead by July 1, 2003. Lead can still be used as an alloying additive in copper, steel and aluminum, and in solderable applications.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

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