You are only 4 steps away from your customized product. (read more)

Our Package Conversion Adapters are an economical alternative to costly board redesign when IC device packages are discontinued or transitioned to newer designs such as finer pitch, lead-free, or surface mount packages. Customized solutions often reduce overall costs by combining or adding functionality, providing improved processing or testing capability by increasing pitch (fan-out), u... (read more)

Learn how to Build-A-Part Number! From pin count to plating type, it's easy to build the exact part number needed for your application. Watch our quick video to learn how, and then select a product from the list to get started. (read more)

Flip-Top™ Test Sockets are engineered for BGA and LGA device test, validation, development, and production socketing applications. Surface mount and through-hole designs from 0.50mm to 1.27mm pitch. (read more)

Quality counts. That's why we at Advanced are committed to our three guiding principles to meet your quality and delivery requirements: communication, consistency and continual improvement (read more)

Advanced Interconnections Corp. has extended its line of Mezza-pede^® SMT Connectors with a new lower profile header (model DHAL) which reduces board stack height by 15%. (read more)

Let Advanced Interconnections design your next PC board connector from our extensive tool box of proven interconnect technology featuring screw-machined terminals for proven reliability across the board. (read more)

Tap into our toolbox of connector know-how. Work directly with our experienced product engineers to create a customized connector, or use our online Build-A-Part™ tool to configure one of our standard designs to meet the needs of your application.

Advanced Interconnections can quickly design a customized solution for surface-mount socketing, or device package conversion, by... (read more)

Video shows how to quickly build a part number for the exact IC Socket, Adapter, or Board-to-Board Connector required for your application in just a few clicks with the Advanced Interconnections' Build-A-Part tool. Learn how to use the handy tool in this informative video or visit the advanced.com website to get started. (read more)

Advanced Interconnections specializes in customized interconnect solutions using 35+ years of interconnect ingenuity and innovative design features to reduce PC board processing and product assembly time and costs. (read more)

Customized board-to-board connectors from Advanced Interconnections Corp. solve difficult design challenges with innovative solutions that work around PC board space constraints, enable automated assembly, facilitate blind mating, and more. (read more)

From prototype to production volumes, we provide affordable connector solutions matched to your specific requirements. Proven reliability combined with design flexibility ensure effective results for even the most demanding SMT and thru-hole applications. High-quality screw-machined terminals provide reliable electrical/mechanical interconnects. (read more)

BGA, LGA, or QFP to QFP footprint on the PCB

Advanced's proprietary Solder Sphere Interface streamlines package conversion for use on PC boards with existing QFP pads. Our Adapters and Interposers are custom designed to convert BGA, LGA, or other device packages to an existing QFP footprint or QFP to QFP with the same or different footprint. (read more)

Peel-A-Way^® Removable Socket Terminal Carriers from Advanced Interconnections.

Peel-A-Way^® products are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. (read more)

Peel-A-Way® Removable Terminal Carriers from Advanced Interconnections Corp. reduce PC board assembly time by eliminating hand-loading of socket terminals and pins. (read more)

Mezza-pede^® low profile 1mm pitch SMT Connectors from Advanced are designed for board-to-board or cable-to-board applications where long-term reliability is required. (read more)

Peel-A-Way^® DIP Socket Terminal Carriers from Advanced are a low profile, lightweight alternative to traditional, molded dual inline sockets. The high temperature carrier can be easily removed after processing for complete solder joint visibility and improved air flow. (read more)

BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles. Designs for package conversion are also available. (read more)

Rectangular Type Adapters for .050" (1.27mm) Pitch SOIC devices. Standard and lead-free designs featuring screw-machined terminals. (read more)

Unique solder perform terminals from Advanced Interconnections Corp. (Advanced) reduce assembly costs by eliminating time-consuming steps in PC board processing. (read more)

A new line of customized surface mount connectors from Advanced Interconnections reduces board space by utilizing the perimeter of circular and other odd-shaped PC boards. To support prototypes and small volume runs, Advanced can provide an affordable design and rough sample for electrical and mechanical testing, typically in less than 10 days. (read more)

Durable and highly reliable screw-machined terminals and pins from Advanced Interconnections.

Advanced designs and manufactures hundreds of RoHS Compliant screw-machined terminals (pins and sockets) for high reliability interconnect applications (both standard and custom designs). (read more)

Flip-Top™ BGA Test Sockets from Advanced Interconnections Corp. simplfy testing and validation of BGA and LGA devices, saving space on the board and speeding the test process. Watch our new video to see how easy it is to use. (read more)

1.27mm pitch B2B® SMT Connectors, featuring solder ball terminals, provide a highly reliable method to define stack height between two PC boards. Compact design conserves board space by combining many signal, ground, and power pins in a dense area. (read more)

Peel-A-Way® Removable Terminal Carriers offer ultimate design flexibility and a simple, economical method for automated pin loading. (read more)

Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. The low insertion force design facilitates easy device replacement or field repair in production applications - eliminating the time, cost, and potential board damage caused by desoldering devices. (read more)