Technical Articles
CAES has published these technical articles:
(Diodes)
From this Article:
The PIN diode finds wide usage in RF, UHF and microwave circuits. It is fundamentally a device whose impedance, at these frequencies, is controlled by DC excitation. A unique feature of the PIN diode...
(Semiconductors)
From this Article:
There are two types of field-effect transistors, the Junction Field-Effect Transistor (JFET) and the "Metal-Oxide Semiconductor" Field-Effect Transistor (MOSFET), or Insulated-Gate Field-Effect...
(RF, Microwave, and Wireless Components)
From this Article:
Design of the solid-state, small-signal RF amplifier using two-port parameters is a systematic, mathematical procedure, with an exact solution (free from approximation) available for the complete...
(RF, Microwave, and Wireless Components)
From this Article:
Some graphic and numerical methods of impedance matching will be reviewed here. The examples given will refer to high frequency power amplifiers. Although matching networks normally take the form of...
(Semiconductors)
From this Article:
Increasing ESD protection of GaAs devices in various applications is critical to long term reliability of the final products. This application note explains how a simple two device circuit delivers...
(RF, Microwave, and Wireless Components)
From this Article:
The DR65-0109 provides 2 complementary outputs that are each capable of driving a maximum of _50 mA into a load. In addition, with proper capacitor selection (C3 & C4) used in parallel with the...
(RF, Microwave, and Wireless Components)
From this Article:
Listed among many of M/A-COM's products are files that describe the small signal scattering matrix, or sparameters, of the device. The S2P format is an industry standard and thus is recognized by many...
(RF, Microwave, and Wireless Components)
From this Article:
GaAs monolithic microwave integrated circuits (MMICs) are widely used in commercial and military microwave systems. Due to the fine geometry used in MMIC transistors, these circuits are susceptible to...
(Semiconductors)
From this Article:
This application note describes M/A-COM's standard Known Good Die (KGD) delivery practices for use in high volume commercial applications. All KGD are electrically tested, visually inspected, and...
(Semiconductors)
From this Article:
M/A-COM supplies integrated circuits, diodes, and related surface mount components in tape wound on standard 7-inch, 8-inch, 10-inch, and 13-inch diameter reels. This application note documents the...
(RF, Microwave, and Wireless Components)
From this Article:
Surface mount board layout is a critical portion of the total design. The footprint must be the correct size to ensure proper solder connection interface between the board and the package. With the...
(RF, Microwave, and Wireless Components)
From this Article:
Early in 1994, M/A-COM began offering a family of plastic packaged GaAs MMIC low noise amplifiers (LNAs) featuring single positive supply voltage, low noise figure, high dynamic range, and low power...
(RF, Microwave, and Wireless Components)
From this Article:
A test methodology will be presented which combines the advantage of on-wafer RF probing with a TRL calibration to create a completely de-embeddable, novel "test fixture" capable of electrically...
(RF, Microwave, and Wireless Components)
From this Article:
The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder...